Search International and National Patent Collections

1. (WO2015115483) FLUX FOR SOLDERING AND SOLDER COMPOSITION

Pub. No.:    WO/2015/115483    International Application No.:    PCT/JP2015/052364
Publication Date: Fri Aug 07 01:59:59 CEST 2015 International Filing Date: Thu Jan 29 00:59:59 CET 2015
IPC: B23K 35/363
H01L 21/60
B23K 35/26
C22C 13/00
H05K 3/34
Applicants: FUJI ELECTRIC CO., LTD.
富士電機株式会社
Inventors: SHOHJI Ikuo
荘司 郁夫
GANBE Tatsuya
雁部 竜也
WATANABE Hirohiko
渡邉 裕彦
Title: FLUX FOR SOLDERING AND SOLDER COMPOSITION
Abstract:
Provided is a flux composition for solders, which is thermally cured so as to cover and reinforce a solder ball during solder ball bonding. Used is a flux for soldering, which contains an epoxy resin, an organic carboxylic acid containing at least 0.1-40% by mass of a dicarboxylic acid having a molecular weight of 180 or less, and a thixotropy-imparting agent. The epoxy resin and the organic carboxylic acid are blended so that the amount of the carboxyl groups of the organic carboxylic acid is 0.8-2.0 equivalents per 1.0 equivalent of the of epoxy groups of the epoxy resin. The epoxy resin, the organic carboxylic acid and the thixotropy-imparting agent are contained in an amount of 70% by mass or more in total relative to the total mass of the flux.