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|1. (WO2015115483) FLUX FOR SOLDERING AND SOLDER COMPOSITION|
|Applicants:||FUJI ELECTRIC CO., LTD.
|Title:||FLUX FOR SOLDERING AND SOLDER COMPOSITION|
Provided is a flux composition for solders, which is thermally cured so as to cover and reinforce a solder ball during solder ball bonding. Used is a flux for soldering, which contains an epoxy resin, an organic carboxylic acid containing at least 0.1-40% by mass of a dicarboxylic acid having a molecular weight of 180 or less, and a thixotropy-imparting agent. The epoxy resin and the organic carboxylic acid are blended so that the amount of the carboxyl groups of the organic carboxylic acid is 0.8-2.0 equivalents per 1.0 equivalent of the of epoxy groups of the epoxy resin. The epoxy resin, the organic carboxylic acid and the thixotropy-imparting agent are contained in an amount of 70% by mass or more in total relative to the total mass of the flux.