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1. (WO2015115482) THERMALLY CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2015/115482    International Application No.:    PCT/JP2015/052363
Publication Date: Fri Aug 07 01:59:59 CEST 2015 International Filing Date: Thu Jan 29 00:59:59 CET 2015
IPC: H01L 23/36
C08J 5/18
Applicants: SUMITOMO BAKELITE CO., LTD.
住友ベークライト株式会社
Inventors: MOCHIZUKI Shunsuke
望月 俊佑
KITAGAWA Kazuya
北川 和哉
SHIRATO Yoji
白土 洋次
NAGAHASHI Keita
長橋 啓太
TSUDA Mika
津田 美香
MAJI Satoshi
馬路 哲
KUROKAWA Motomi
黒川 素美
HIRASAWA Kazuya
平沢 憲也
Title: THERMALLY CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE
Abstract:
This thermally conductive sheet contains a thermosetting resin (A) and an inorganic filler (B) that is dispersed in the thermosetting resin (A). A cured product of this thermally conductive sheet has a volume resistivity of 1.0 × 108 Ω·m or more at 175°C as measured in accordance with JIS K6911 one minute after the application of a voltage of 1,000 V.