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1. (WO2015114771) Cu CORE BALL, SOLDER JOINT, FOAM SOLDER, AND SOLDER PASTE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/114771 International Application No.: PCT/JP2014/052099
Publication Date: 06.08.2015 International Filing Date: 30.01.2014
IPC:
B22F 1/00 (2006.01) ,B22F 1/02 (2006.01) ,B23K 35/14 (2006.01) ,B23K 35/30 (2006.01) ,C22B 15/14 (2006.01) ,C22F 1/08 (2006.01) ,C25D 7/00 (2006.01) ,H01L 21/60 (2006.01) ,C22F 1/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
02
comprising coating of the powder
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02
characterised by mechanical features, e.g. shape
12
not specially designed for use as electrodes
14
for soldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
30
with the principal constituent melting at less than 1550°C
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
B
PRODUCTION OR REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
15
Obtaining copper
14
Refining
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08
of copper or alloys based thereon
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Applicants: SENJU METAL INDUSTRY CO., LTD.[JP/JP]; 23, Senju-Hashido-Cho, Adachi-Ku, Tokyo 1208555, JP
Inventors: KAWASAKI Hiroyoshi; JP
KONDOH Shigeki; JP
ROPPONGI Takahiro; JP
SOMA Daisuke; JP
SATO Isamu; JP
Agent: YAMAGUCHI INTERNATIONAL PATENT FIRM; Waizemu Building 2F #A, 3-3-8, Ueno, Taito-ku, Tokyo 1100005, JP
Priority Data:
Title (EN) Cu CORE BALL, SOLDER JOINT, FOAM SOLDER, AND SOLDER PASTE
(FR) BILLE À NOYAU DE Cu, RACCORD DE SOUDURE, SOUDURE EN MOUSSE ET PÂTE DE SOUDURE
(JA) Cu核ボール、はんだ継手、フォームはんだ、およびはんだペースト
Abstract:
(EN) The present invention suppresses occurrences of soft errors while assuring alignment properties when mounting a Cu core ball on an electrode. A Cu core ball (11) is provided with a Cu ball (1) and a metal layer (2) that coats the surface of this Cu ball (1). The metal layer (2) is formed from one or more elements selected from Ni, Co, and Fe. The Cu ball (1) is such that the purity is 99.9 - 99.995%, the U content is 5 ppb or less, the Th content is 5 ppb or less, the total amount for the content of at least one of Pb and Bi is 1 ppm or greater, the sphericity is 0.95 or greater, and the alpha dose is 0.0200 cph/cm2 or less.
(FR) La présente invention vise à supprimer des apparitions d'erreurs passagères tout en assurant des propriétés d'alignement lors du montage d'une bille à noyau de Cu sur une électrode. A cet effet, l'invention porte sur une bille à noyau de Cu (11), laquelle bille comporte une bille de Cu (1) et une couche métallique (2) qui revêt la surface de cette bille de Cu (1). La couche métallique (2) est constituée par un ou plusieurs éléments sélectionnés parmi Ni, Co et Fe. La bille de Cu (1) est telle que la pureté est de 99,9 à 99,995 %, la teneur en U est de 5 ppb ou moins, la teneur en Th est de 5 ppb ou moins, la quantité totale pour la teneur de Pb et/ou de Bi est de 1 ppm ou plus, la sphéricité est de 0,95 ou plus, et la dose alpha est de 0,0200 cph/cm2 ou moins.
(JA) Cu核ボールの電極上への実装時のアライメント性を確保しつつ、ソフトエラーの発生を抑制する。 Cu核ボール11は、Cuボール1と、このCuボール1表面を被覆する金属層2とを備える。金属層2は、Ni,Co,Feから選択される1以上の元素からなる。Cuボール1は、純度が99.9%以上99.995%以下であり、Uの含有量が5ppb以下であり、Thの含有量が5ppb以下であり、PbおよびBiの少なくとも一方の含有量の合計量が1ppm以上であり、真球度が0.95以上であり、α線量が0.0200cph/cm以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)