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|1. (WO2015113364) INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE|
|Applicants:||BOE TECHNOLOGY GROUP CO., LTD.
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
PARK, Seung Yik
|Title:||INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE|
An integrated circuit chip and a display device. The integrated circuit chip (109) comprises a plurality of conductive metal sheets arranged on one surface of the chip at intervals and conductive protrusions (111) formed on the conductive metal sheets. Due to the fact that the conductive protrusions (111) are formed on the conductive metal sheets of the integrated circuit chip (109), a non-conductive bonding layer such as NCF can be adopted for replacing ACF to bond the integrated circuit chip (109) and a display panel without generating metallic stacking, and the problem of short circuit or overlarge resistance will not occur. Production cost of the display device can be reduced and industrialized production is facilitated more by using the NCF for replacing the ACF.