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1. (WO2015113364) INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE

Pub. No.:    WO/2015/113364    International Application No.:    PCT/CN2014/080460
Publication Date: Fri Aug 07 01:59:59 CEST 2015 International Filing Date: Sat Jun 21 01:59:59 CEST 2014
IPC: H01L 23/492
G09F 9/35
Applicants: BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
成都京东方光电科技有限公司
Inventors: BAO, Junping
暴军萍
HE, Wei
贺伟
LI, Xinghua
李兴华
PARK, Seung Yik
朴承翊
Title: INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE
Abstract:
An integrated circuit chip and a display device. The integrated circuit chip (109) comprises a plurality of conductive metal sheets arranged on one surface of the chip at intervals and conductive protrusions (111) formed on the conductive metal sheets. Due to the fact that the conductive protrusions (111) are formed on the conductive metal sheets of the integrated circuit chip (109), a non-conductive bonding layer such as NCF can be adopted for replacing ACF to bond the integrated circuit chip (109) and a display panel without generating metallic stacking, and the problem of short circuit or overlarge resistance will not occur. Production cost of the display device can be reduced and industrialized production is facilitated more by using the NCF for replacing the ACF.