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1. (WO2015105741) HIGH POWER PORTABLE DEVICE AND DOCKING SYSTEM
Latest bibliographic data on file with the International Bureau   
Pub. No.: WO/2015/105741 International Application No.: PCT/US2015/010100
Publication Date: 16.07.2015 International Filing Date: 05.01.2015
IPC:
H05K 7/20 (2006.01) ,G06F 1/16 (2006.01) ,G06F 1/20 (2006.01) ,H02B 1/56 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
20
Cooling means
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
B
BOARDS, SUBSTATIONS, OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
1
Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
56
Cooling; Ventilation
Applicants:
TANGO TECH, INC [US/US]; 11440 W. Bernardo Court, Suite 300 San Diego, California 92127, US
Inventors:
SHAH, Bhavesh; US
Agent:
BURKETTE, Scott L.; Wilson Sonsini Goodrich & Rosati 650 Page Mill Road Palo Alto, California 94304, US
Priority Data:
61/924,85808.01.2014US
Title (EN) HIGH POWER PORTABLE DEVICE AND DOCKING SYSTEM
(FR) DISPOSITIF PORTABLE HAUTE PUISSANCE ET SYSTÈME D'ACCUEIL
Abstract:
(EN) A system includes a high performance but very compact device and an associated docking station. The device may include a processor that is contained within a housing which defines a heat transmission surface that is thermally coupled to the processor and other heat generating components. The docking station includes a portion for receiving the housing of the device, a thermally conductive substrate defining a heat receiving surface, and an array of conductive fibers thermally coupled the heat transmitting surface to the heat receiving surface. This forms a dry low pressure thermal coupling interface capable of repeated thermal coupling and decoupling. This is advantageous relative to traditional semi liquid or liquid thermal compounds or compliant thermal pads which require high pressure or unreliable repetitive thermal coupling and decoupling. The thermal dissipation mechanism is therefore largely separated from the device and therefore it becomes very compact.
(FR) L'invention concerne un système qui comprend un dispositif à haute performance, mais très compact, et une station d'accueil associée. Le dispositif peut comprendre un processeur qui est contenu dans un boîtier qui définit une surface de transmission de chaleur qui est couplée thermiquement au processeur et à d'autres composants de génération de chaleur. La station d'accueil comprend une partie destinée à recevoir le boîtier du dispositif, un substrat thermiquement conducteur définissant une surface de réception de chaleur, et un réseau de fibres conductrices couplant thermiquement la surface de transmission de chaleur à la surface de réception de chaleur. Ceci forme une interface de couplage thermique sèche basse pression capable de couplages et de découplages thermiques répétés. Cela est avantageux par rapport aux composés thermiques semi-liquides ou liquides ou plages thermiques souples traditionnels qui nécessitent une pression élevée ou un couplage et un découplage thermiques répétés peu fiables. Le mécanisme de dissipation thermique est ainsi en grande partie séparé du dispositif et, par conséquent, il devient très compact.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)