Search International and National Patent Collections

1. (WO2015048575) LOW DIELECTRIC CONSTANT, LOW DIELECTRIC DISSIPATION FACTOR COATINGS, FILMS AND ADHESIVES

Pub. No.:    WO/2015/048575    International Application No.:    PCT/US2014/057903
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Sat Sep 27 01:59:59 CEST 2014
IPC: C08L 79/08
C09D 179/08
C09J 179/08
C08G 73/12
C08F 222/40
C08F 226/06
Applicants: DESIGNER MOLECULES, INC.
MIZORI, Farhad G.
Inventors: MIZORI, Farhad G.
Title: LOW DIELECTRIC CONSTANT, LOW DIELECTRIC DISSIPATION FACTOR COATINGS, FILMS AND ADHESIVES
Abstract:
Curable functionalized imide-linked polyimides compounds have been synthesized that have been found to possess very low dielectric constant and extremely low dissipation factor. These compounds also have a range of high to low modulus, extremely low moisture uptake and are very thermally stable. The combination of these materials in formulation along with functionalized polyethylene, polypropylene, polybutadiens have been found to be ideal for forming films and coatings for the microelectronic applications, multiplayer capacitors and interconnects, and high power cables and wire coatings. The addition of perfluorinated hydrocarbons, and POSS nanoparticles to the formulations have decreased the dielectric constant and dielectric dissipation factor further, and have also improved the flammability of the compositions.