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1. (WO2015047346) AN IMPROVED ARRANGEMENT OF THROUGH-HOLE STRUCTURES OF A SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2015/047346    International Application No.:    PCT/US2013/062457
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Sat Sep 28 01:59:59 CEST 2013
IPC: H01L 29/84
Applicants: INTEL CORPORATION
Inventors: TEH, Weng Hong
HANEY, Sarah K.
LIM, Chyi Hwang
Title: AN IMPROVED ARRANGEMENT OF THROUGH-HOLE STRUCTURES OF A SEMICONDUCTOR PACKAGE
Abstract:
A semiconductor package comprising a suspended beam portion including an arrangement of through-hole structures. In an embodiment, a first surface of the suspended beam portion includes edges each defining in part a respective through-hole of a plurality of through-holes extending between the first surface and a second surface. The first surface comprises a plurality of arm portions each located between a respective pair of edge-adjacent edges. The first surface comprises a plurality of node portions each located at a respective junction of three or more of the plurality of arm portions. In another embodiment, for each of the plurality of node portions, a respective total number of arm portions which join one another at the node portion is a number other than four, or two arm portions which join one another at the node portion have respective mid-lines which are oblique to one another.