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1. (WO2015047217) AN IMPROVED ENCLOSURE FOR HERMETICAL ENCAPSULATED ELECTRONICS

Pub. No.:    WO/2015/047217    International Application No.:    PCT/US2013/061329
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Wed Sep 25 01:59:59 CEST 2013
IPC: H05K 7/14
H05K 7/20
Applicants: GE INTELLIGENT PLATFORMS, INC.
Inventors: SPORER, Bernd
Title: AN IMPROVED ENCLOSURE FOR HERMETICAL ENCAPSULATED ELECTRONICS
Abstract:
Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.