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1. (WO2015046280) CU/CERAMIC MATERIAL JOINT, METHOD FOR MANUFACTURING CU/CERAMIC MATERIAL JOINT, AND SUBSTRATE FOR POWER MODULE

Pub. No.:    WO/2015/046280    International Application No.:    PCT/JP2014/075339
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Fri Sep 26 01:59:59 CEST 2014
IPC: C04B 37/02
B32B 15/04
B32B 18/00
H01L 23/12
H01L 23/13
H01L 23/36
H01L 23/373
H01L 25/07
H01L 25/18
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: TERASAKI Nobuyuki
寺▲崎▼ 伸幸
NAGATOMO Yoshiyuki
長友 義幸
Title: CU/CERAMIC MATERIAL JOINT, METHOD FOR MANUFACTURING CU/CERAMIC MATERIAL JOINT, AND SUBSTRATE FOR POWER MODULE
Abstract:
A Cu/ceramic material joint according to the present invention is produced by joining a copper member comprising copper or a copper alloy to a ceramic member comprising AlN or Al2O3 using a joint material containing Ag and Ti, wherein a Ti compound layer comprising a Ti nitride or a Ti oxide is formed at the joint interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.