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|1. (WO2015046280) CU/CERAMIC MATERIAL JOINT, METHOD FOR MANUFACTURING CU/CERAMIC MATERIAL JOINT, AND SUBSTRATE FOR POWER MODULE|
|Applicants:||MITSUBISHI MATERIALS CORPORATION
|Title:||CU/CERAMIC MATERIAL JOINT, METHOD FOR MANUFACTURING CU/CERAMIC MATERIAL JOINT, AND SUBSTRATE FOR POWER MODULE|
A Cu/ceramic material joint according to the present invention is produced by joining a copper member comprising copper or a copper alloy to a ceramic member comprising AlN or Al2O3 using a joint material containing Ag and Ti, wherein a Ti compound layer comprising a Ti nitride or a Ti oxide is formed at the joint interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.