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1. (WO2015046163) POLISHING COMPOSITION AND PRODUCTION METHOD THEREFOR
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/046163 International Application No.: PCT/JP2014/075123
Publication Date: 02.04.2015 International Filing Date: 22.09.2014
IPC:
C09K 3/14 (2006.01) ,B24B 37/00 (2012.01) ,H01L 21/304 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社フジミインコーポレーテッド FUJIMI INCORPORATED [JP/JP]; 愛知県清須市西枇杷島町地領二丁目1番地1 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502, JP
Inventors:
土屋 公亮 TSUCHIYA, Kohsuke; JP
森 嘉男 MORI, Yoshio; JP
Agent:
安部 誠 ABE Makoto; JP
Priority Data:
2013-20446630.09.2013JP
Title (EN) POLISHING COMPOSITION AND PRODUCTION METHOD THEREFOR
(FR) COMPOSITION DE POLISSAGE ET PROCÉDÉ DE PRODUCTION CORRESPONDANT
(JA) 研磨用組成物およびその製造方法
Abstract:
(EN) Provided is a polishing composition capable of efficiently reducing surface defects. A polishing composition including a water-soluble polymer (MC-end) is provided as a result of the present invention. The main chain of the water-soluble polymer (MC-end) comprises a non-cationic region as a main constituent region and a cationic region positioned in at least one end of the main chain. The cationic region has at least one cationic group.
(FR) La présente invention se rapporte à une composition de polissage capable de réduire efficacement les défauts de surface. Cette invention concerne également la production d'une composition de polissage comprenant un polymère soluble dans l'eau (MC-extrémité) i. La chaîne principale du polymère soluble dans l'eau (MC-extrémité) i comprend une région non-cationique en tant que constituant principal et une région cationique positionnée dans au moins une extrémité de la chaîne principale. La région cationique possède au moins un groupe cationique.
(JA)  表面欠陥を効率よく低減し得る研磨用組成物を提供する。本発明によると、水溶性高分子MC-endを含む研磨用組成物が提供される。前記水溶性高分子MC-endの主鎖は、主構成領域としての非カチオン性領域と、該主鎖の少なくとも一方の端部に位置するカチオン性領域と、からなる。前記カチオン性領域は、少なくとも1つのカチオン性基を有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)