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1. (WO2015046063) SHIELDING HOUSING, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SHIELDING HOUSING

Pub. No.:    WO/2015/046063    International Application No.:    PCT/JP2014/074868
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Sat Sep 20 01:59:59 CEST 2014
IPC: H05K 9/00
B32B 7/02
C09J 7/00
C09J 9/02
C09J 201/00
Applicants: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
タツタ電線株式会社
Inventors: IKOMA, Koujirou
生駒 光司郎
HORIO, Yuuki
堀尾 裕貴
YOSHINO, Shinji
芳野 眞次
Title: SHIELDING HOUSING, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SHIELDING HOUSING
Abstract:
This invention provides: a shielding housing that allows reduced thickness and easier handling; a printed circuit board; an electronic device; and a method for manufacturing a shielding housing. This shielding housing (10) is formed from a shielding film (1) that contains: a conductive layer (3); a conductive adhesive layer (4) that is laminated to said conductive layer (3) and adheres to an attachment site containing a ground pattern (22) on a printed circuit board (20); and a peel-away film (5) that is laminated to the conductive adhesive layer (4) so as to be able to be peeled away therefrom, is electrically insulating, and is peeled away so as to leave sections that cover exposed surfaces of an electronic circuit (40). This shielding housing (10) comprises: a housing section (11) that has a protruding shape that accommodates the aforementioned electronic circuit (40), and is oriented such that the peel-away film (5) is on the side facing the electronic circuit (40); and a flange section (12) that surrounds the housing section (11).