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1. (WO2015045856) ELECTRIC CONTACT MATERIAL FOR CONNECTOR, AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/045856 International Application No.: PCT/JP2014/073859
Publication Date: 02.04.2015 International Filing Date: 10.09.2014
Chapter 2 Demand Filed: 27.02.2015
IPC:
C25D 7/00 (2006.01) ,C25D 5/10 (2006.01) ,H01R 13/03 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
澤田 滋 SAWADA Shigeru; JP
Agent:
特許業務法人あいち国際特許事務所 AICHI, TAKAHASHI, IWAKURA & ASSOCIATES; 愛知県名古屋市中村区名駅3丁目26番19号 名駅永田ビル Meieki Nagata Building, 26-19, Meieki 3-chome, Nakamura-ku, Nagoya-shi, Aichi 4500002, JP
Priority Data:
2013-20310330.09.2013JP
Title (EN) ELECTRIC CONTACT MATERIAL FOR CONNECTOR, AND METHOD FOR PRODUCING SAME
(FR) MATÉRIAU DE CONTACT ÉLECTRIQUE POUR CONNECTEUR ET SON PROCÉDÉ DE FABRICATION
(JA) コネクタ用電気接点材料及びその製造方法
Abstract:
(EN) An electric contact material for a connector comprises: a base material (10) made from a metallic material; an alloy layer (2) of a ternary or higher system, which is formed on the base material (10), contains Sn and Cu, and additionally contains at least one metal selected from Zn, Co, Ni and Pd; and an electrically conductive coating film layer (3) which is formed on the surface of the alloy layer (2). The alloy layer (2) contains an intermetallic compound which is produced by substituting a part of Cu in Cu6Sn5 by at least one kind of metal selected from Zn, Co, Ni and Pd. It is preferred that the content of the at least one kind of metal selected from Zn, Co, Ni and Pd in the alloy layer (2) falls within the range from 1 to 50 at.% wherein the total content of the at least one kind of metal and Cu is 100 at.%.
(FR) L'invention porte sur un matériau de contact électrique, pour un connecteur, qui comporte : un matériau de base (10) fait d'un matériau métallique ; une couche d'alliage (2) de type système ternaire ou supérieur, qui est formée sur le matériau de base (10), qui contient du Sn et du Cu et qui contient de plus au moins un métal choisi parmi Zn, Co, Ni et Pd ; une couche de film de revêtement conducteur de l'électricité (3) qui est formée sur la surface de la couche d'alliage (2). La couche d'alliage (2) contient un composé intermétallique qui est obtenu par remplacement d'une partie de Cu dans Cu6Sn5 par au moins une sorte de métal choisi parmi Zn, Co, Ni et Pd. De préférence, la teneur de ladite sorte de métaux choisies parmi Zn, Co, Ni et Pd dans la couche d'alliage (2) se trouve dans la plage allant de 1 à 50 % at., la teneur totale de ladite sorte de métaux et de Cu étant de 100 % at.
(JA)  金属材料よりなる基材10と、基材10上に形成された、Sn及びCuを含み、さらに、Zn、Co、Ni及びPdから選択される1種又は2種以上の金属を含む3元系又は4元系以上の合金層2と、合金層2の表面に形成された導電性皮膜層3とを有する。合金層2は、Cu6Sn5におけるCuの一部を、Zn、Co、Ni及びPdから選択される1種又は2種以上の金属に置換してなる金属間化合物を含有している。合金層2におけるZn、Co、Ni及びPdから選択される1種又は2種以上の金属の含有量は、Cuと合わせた合計含有量を100原子%とした場合、1~50原子%の範囲内であることが好ましい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)