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1. (WO2015045602) THERMOELECTRIC MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/045602 International Application No.: PCT/JP2014/069663
Publication Date: 02.04.2015 International Filing Date: 25.07.2014
IPC:
H01L 35/32 (2006.01) ,H01L 23/38 (2006.01) ,H01L 23/40 (2006.01) ,H01L 35/34 (2006.01) ,H02N 11/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
38
Cooling arrangements using the Peltier effect
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34
Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
N
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
11
Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
赤羽 賢一 AKABANE, Kenichi; JP
Priority Data:
2013-20094727.09.2013JP
Title (EN) THERMOELECTRIC MODULE
(FR) MODULE THERMOÉLECTRIQUE
(JA) 熱電モジュール
Abstract:
(EN) This thermoelectric module comprises: a first support substrate comprising a main surface that has a first region and a second region adjacent to the first region; a second support substrate provided such that the main surface thereof faces the first region; a plurality of thermoelectric elements arrayed between the first region and the main surface of the second support substrate; and a temperature detection element mounted on the second region. The temperature detection element and the second support substrate are thermally connected via a thermally conductive member.
(FR) L’invention porte sur un module thermoélectrique qui comprend : un premier substrat de support comprenant une surface principale, qui possède une première région et une seconde région qui est adjacente à la première région ; un second substrat de support disposé de telle sorte que la surface principale de ce dernier est opposée à la première région ; une pluralité d’éléments thermoélectriques disposés entre la première région et la surface principale du second substrat de support ; et un élément de détection de température monté sur la seconde région. L’élément de détection de température et le second substrat de support sont thermiquement connectés par l’intermédiaire d’un élément thermoconducteur.
(JA)  本発明の熱電モジュールは、第1領域および第1領域に隣接する第2領域を有する主面を備えた第1支持基板と、第1領域に主面が対向するように設けられた第2支持基板と、第1領域および第2支持基板の主面の間に複数配列された熱電素子と、第2領域に実装された温度検知素子とを備えており、温度検知素子と第2支持基板とが熱伝導部材を介して熱的に接続されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)