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1. (WO2015045475) ALIGNMENT METHOD AND ALIGNMENT DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/045475 International Application No.: PCT/JP2014/062824
Publication Date: 02.04.2015 International Filing Date: 14.05.2014
IPC:
C23C 14/04 (2006.01) ,G01B 11/00 (2006.01) ,G03F 9/00 (2006.01) ,H01L 21/027 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04
Coating on selected surface areas, e.g. using masks
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9
Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants:
キヤノントッキ株式会社 CANON TOKKI CORPORATION [JP/JP]; 新潟県見附市新幸町10番1号 10-1, Shinko-cho, Mitsuke-shi, Niigata 9540076, JP
Inventors:
山根 幸男 YAMANE Yukio; JP
石井  博 ISHII Hiroshi; JP
田中 広樹 TANAKA Hiroki; JP
Agent:
吉井  剛 YOSHII Takeshi; 新潟県長岡市城内町3丁目5番地8 5-8, Johnai-cho 3-chome, Nagaoka-shi, Niigata 9400061, JP
Priority Data:
2013-20168327.09.2013JP
Title (EN) ALIGNMENT METHOD AND ALIGNMENT DEVICE
(FR) PROCÉDÉ D'ALIGNEMENT ET DISPOSITIF D'ALIGNEMENT
(JA) アライメント方法並びにアライメント装置
Abstract:
(EN) Provided is an alignment method which is practically superior in capabilities for carrying out high precision alignment. When alignment of a substrate (12) and the mask (11) is carried out, a second imaging unit (14) with a high imaging magnification is positioned using imaging data imaged by a first imaging unit (13) with a low imaging magnification. Two stages of steps are carried out for positional correction for the substrate (12) and the mask (11) with the imaging range of the second imaging unit (14) as a reference: a first alignment step that is carried out using imaging data imaged by the first imaging unit (13), and a second alignment step that is carried out using imaging data imaged by the second imaging unit (14).
(FR) La présente invention concerne un procédé d'alignement qui, dans la pratique, est supérieur en termes de capacités pour la mise en œuvre d'un alignement de haute précision. Lorsque l'alignement d'un substrat (12) et du masque (11) est effectué, une seconde unité d'imagerie (14) à grossissement d'imagerie élevé est positionnée à l'aide de données d'imagerie imagées au moyen d'une première unité d'imagerie (13) à faible grossissement d'imagerie. Deux phases d'étapes sont mises en œuvre pour la correction de position du substrat (12) et du masque (11), la plage d'imagerie de la seconde unité d'imagerie (14) étant utilisée en tant que référence : une première étape d'alignement qui est effectuée à l'aide de données d'imagerie imagées par la première unité d'imagerie (13), et une seconde étape d'alignement qui est effectuée à l'aide de données d'imagerie imagées par la seconde unité d'imagerie (14).
(JA)  高精度なアライメントを行うことができる実用性に優れたアライメント方法の提供。基板12とマスク11のアライメントを行う際、撮像倍率の低い第1の撮像部13で撮像した撮像データを用いて撮像倍率の高い第2の撮像部14を位置決めし、この第2の撮像部14の撮像範囲を基準として、基板12とマスク11との位置補正を、第1の撮像部13で撮像した撮像データを用いて行う第1アライメント工程と第2の撮像部14で撮像した撮像データを用いて行う第2アライメント工程との2段階で行う。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)