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1. (WO2015045449) LAMINATE AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/045449 International Application No.: PCT/JP2014/058768
Publication Date: 02.04.2015 International Filing Date: 27.03.2014
IPC:
C23C 28/00 (2006.01) ,B32B 15/04 (2006.01) ,C23C 18/16 (2006.01) ,C25D 5/34 (2006.01) ,C25D 13/20 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
28
Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/-C23C26/173
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
13
Electrophoretic coating
20
Pretreatment
Applicants:
豊田合成 株式会社 TOYODA GOSEI CO., LTD. [JP/JP]; 愛知県清須市春日長畑1番地 1, Haruhinagahata, Kiyosu-shi, Aichi 4528564, JP
Inventors:
安藤 宏明 ANDO, Hiroaki; JP
井土 尚泰 IDO, Takayasu; JP
吉田 順治 YOSHIDA, Junji; JP
度会 弘志 WATARAI, Hiroshi; JP
森本 健二郎 MORIMOTO, Kenjiro; JP
Agent:
恩田 誠 ONDA, Makoto; 岐阜県岐阜市大宮町二丁目12番地1 12-1, Ohmiya-cho 2-chome, Gifu-shi, Gifu 5008731, JP
Priority Data:
2013-19973026.09.2013JP
Title (EN) LAMINATE AND METHOD FOR PRODUCING SAME
(FR) STRATIFIÉ ET SON PROCÉDÉ DE PRODUCTION
(JA) 積層体及びその製造方法
Abstract:
(EN) The problem addressed by the present invention is to provide: a laminate that has increased adhesiveness between an Sn plating layer and a coating film laminated on the Sn plating layer, and that can prevent delamination at the interface surface; and a method for producing the laminate. The method for producing a laminate resulting from electrically forming a deposit layer on an Sn plating layer laminated to the surface of a substrate is provided with: an Sn plating step for laminating a glossy Sn plating layer comprising Sn or an Sn alloy onto a substrate in a plating solution containing Sn and a brightener; an acid dipping processing step after the Sn plating step for immersing the glossy Sn plating layer on the substrate in a sulfuric acid solution having a concentration of at least 10 mass% or a hydrochloric acid solution having a concentration of at least 3.5 mass% at 50-80°C for 1-30 minutes; and a deposit layer forming step after the acid dipping processing step for electrically forming a deposit layer on the Sn plating layer.
(FR) Le problème décrit par la présente invention est de fournir un stratifié, qui a une adhésivité accrue entre une couche de placage de Sn et une couche de revêtement stratifiée sur la couche de placage de Sn, et qui peut empêcher un délaminage à la surface d'interface ; et un procédé pour produire le stratifié. Le procédé pour produire un stratifié résultant de la formation de manière électrique d'une couche de dépôt sur une couche de placage de Sn stratifiée sur la surface d'un substrat comprend : une étape de placage de Sn consistant à stratifier une couche de placage de Sn brillante, comprenant du Sn ou un alliage de Sn, sur un substrat dans une solution de placage contenant du Sn et un brillanteur ; une étape de traitement par trempage dans l'acide après l'étape de placage de Sn consistant à immerger la couche de placage de Sn brillante sur le substrat dans une solution d'acide sulfurique ayant une concentration d'au moins 10 % en masse ou une solution d'acide chlorhydrique ayant une concentration d'au moins 3,5 % en masse à 50-80 °C pendant 1 à 30 minutes ; et une étape de formation de couche de dépôt après l'étape de traitement par trempage dans l'acide consistant à former électriquement une couche de dépôt sur la couche de placage de Sn.
(JA)  本発明の課題は、Snめっき層とSnめっき層上に積層される皮膜との間の付着性を向上させ、境界面での剥離を防止することが可能な積層体及びその製造方法を提供することである。基材の表面に積層されたSnめっき層上に電気的に析出層を形成してなる積層体の製造方法は、光沢剤とSnを含むめっき浴中で、基材上にSn又はSn合金からなる光沢Snめっき層を積層するSnめっき工程と、前記Snめっき工程後に、前記基材上の光沢Snめっき層を10質量%以上の濃度の硫酸溶液又は3.5質量%以上の濃度の塩酸溶液のいずれかに、50~80℃で1~30分間浸漬する酸浸漬処理工程と、前記酸浸漬処理工程後に、前記Snめっき層上に電気的に析出層を形成する析出層形成工程とを備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)