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1. (WO2015045309) PRINTED BOARD, AND METHOD FOR MOUNTING ON PRINTED BOARD

Pub. No.:    WO/2015/045309    International Application No.:    PCT/JP2014/004679
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Fri Sep 12 01:59:59 CEST 2014
IPC: H01P 3/06
H01P 5/02
Applicants: NEC CORPORATION
日本電気株式会社
Inventors: KASHIWAKURA, Kazuhiro
柏倉 和弘
Title: PRINTED BOARD, AND METHOD FOR MOUNTING ON PRINTED BOARD
Abstract:
To provide a printed board that solves the problem of transmission characteristic deterioration. This printed board is provided with: a substrate; a circular signal pad that is provided on the substrate; a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate; and one or more recessed sections that are disposed in the substrate that surrounds, in the doughnut shape, the signal pad.