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1. (WO2015044800) PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/044800 International Application No.: PCT/IB2014/062985
Publication Date: 02.04.2015 International Filing Date: 09.07.2014
IPC:
H01L 21/673 (2006.01) ,B65D 81/02 (2006.01) ,B65D 85/30 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673
using specially adapted carriers
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
D
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
81
Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
02
specially adapted to protect contents from mechanical damage
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
D
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
85
Containers, packaging elements or packages, specially adapted for particular articles or materials
30
for articles particularly sensitive to damage by shock or pressure
Applicants:
INTERNATIONAL BUSINESS MACHINES CORPORATION; New Orchard Road Armonk, New York 10504, US
IBM JAPAN, LTD. [JP/JP]; 19-21 Nihonbashi Tokyo, 103-8510, JP (MG)
Inventors:
CORBIN, Damyon L.; US
MUSANTE, Chares F.; US
Agent:
CANALE, Anthony, J.; US
Priority Data:
14/036,99925.09.2013US
Title (EN) PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
(FR) ENSEMBLE BOÎTIER POUR EXPÉDITION DE PLAQUETTE MINCE ET PROCÉDÉ D'UTILISATION
Abstract:
(EN) A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
(FR) La présente invention concerne un ensemble boîtier destiné à l'expédition d'une plaquette mince à l'aide d'un récipient pour plaquette, ainsi qu'un procédé d'utilisation. L'ensemble boîtier comprend un récipient d'expédition et un récipient pour plaquette ayant une surface de fond et une pluralité de bandoulières fixées sur celui-ci et placées dans le récipient d'expédition. L'ensemble boîtier comprend en outre des plaques supérieure et inférieure de répartition des forces, prévues dans le récipient d'expédition et placées respectivement sur un côté de dessus et un côté de fond du récipient d'expédition.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)