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1. (WO2015044529) ASSEMBLY LEVEL ENCAPSULATION LAYER WITH MULTIFUNCTIONAL PURPOSE, AND METHOD OF PRODUCING THE SAME

Pub. No.:    WO/2015/044529    International Application No.:    PCT/FI2014/050741
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Tue Sep 30 01:59:59 CEST 2014
IPC: H01L 33/52
H01L 31/0203
Applicants: LUMICHIP OY
Inventors: RANTALA, Juha
KATILA, Pekka
Title: ASSEMBLY LEVEL ENCAPSULATION LAYER WITH MULTIFUNCTIONAL PURPOSE, AND METHOD OF PRODUCING THE SAME
Abstract:
A component formed of a substrate (201), semiconductor chip(s) (205), such as an optoelectronic component (200), for example a light emitting diode, electrical contact wire(s) (208), electrical contact layer(s) (204, 210), electrically conductive track(s), and a protective layer (211). The protective layer (211) is optically transparent, it has a thickness is preferably below 100 nm and it is made with the atomic layer deposition method. Embodiments of the present invention solve issues associated with multichip modules and their hermetic sealing.