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1. (WO2015044523) METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRANGEMENT FOR CARRYING OUT THE METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/044523 International Application No.: PCT/FI2014/050729
Publication Date: 02.04.2015 International Filing Date: 25.09.2014
IPC:
B29C 45/14 (2006.01) ,H05K 1/03 (2006.01) ,H05K 1/16 (2006.01) ,H05K 1/18 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
14
incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
16
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
TACTOTEK OY [FI/FI]; Takatie 6 FI-90440 Kempele, FI
Inventors:
HEIKKINEN, Mikko; FI
SÄÄSKI, Jarmo; FI
TORVINEN, Jarkko; FI
NISKALA, Paavo; FI
SIPPARI, Mikko; FI
RAAPPANA, Pasi; FI
KERÄNEN, Antti; FI
Agent:
BERGGREN OY AB; P.O. Box 16 00101 Helsinki, FI
Priority Data:
61/883,48427.09.2013US
Title (EN) METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRANGEMENT FOR CARRYING OUT THE METHOD
(FR) PROCÉDÉ POUR FABRIQUER UNE STRUCTURE ÉLECTROMÉCANIQUE ET AGENCEMENT POUR CONDUIRE LE PROCÉDÉ
Abstract:
(EN) Method for manufacturing an electromechanical structure, com-prising: producing conductors and/or graphics on a substantially flat film 106, attaching electronic elements on the said film 108 in relation to the de-sired three-dimensional shape of the film,forming the said film housing the electronic elements into a substantially three-dimensional shape 110,using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film 112, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure.A corresponding arrangement for carrying out said method is also presented.
(FR) La présente invention concerne un procédé de fabrication d'une structure électromécanique, comprenant : la production de conducteurs et/ou de graphiques sur un film sensiblement plat 106, la fixation d'éléments électroniques sur ledit film 108 conformément à la forme tridimensionnelle souhaitée du film, la formation du film logeant les éléments électroniques en une forme sensiblement tridimensionnelle 110, l'utilisation du film sensiblement tridimensionnel en tant qu'insert dans un processus de moulage par injection par moulage sensiblement sur ledit film 112, une couche de matériau préférée étant fixée à la surface du film, créant une structure électromécanique. L'invention concerne en outre un agencement correspondant pour conduire ledit procédé.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)