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1. (WO2015042769) METHOD FOR FORMING SEMICONDUCTOR ASSEMBLY

Pub. No.:    WO/2015/042769    International Application No.:    PCT/CN2013/084062
Publication Date: Fri Apr 03 01:59:59 CEST 2015 International Filing Date: Wed Sep 25 01:59:59 CEST 2013
IPC: H01L 21/283
H01L 21/336
H01L 21/8234
H01L 21/8238
Applicants: LI, Lifeng
李利锋
Inventors: LI, Lifeng
李利锋
Title: METHOD FOR FORMING SEMICONDUCTOR ASSEMBLY
Abstract:
A method for forming a semiconductor assembly at least comprises the following steps: forming a structure on a chip (200), the structure being provided with a first layer and a masking layer (213), and the first layer being provided with a pre-doped polysilicon layer; before the masking layer (213) is removed, oxidizing the chip (200) to generate an oxidized layer; and removing the masking layer (213).