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1. (WO2015041164) GLUE GUN
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/041164    International Application No.:    PCT/JP2014/074192
Publication Date: 26.03.2015 International Filing Date: 12.09.2014
B05C 5/04 (2006.01)
Applicants: TECHNOS CO., LTD. [JP/JP]; 8-5, Kashiwanoha 1-chome, Kashiwa-shi, Chiba 2770082 (JP)
Inventors: ONO Kazuhiko; (JP)
Agent: KIFUNE Hideo; (JP)
Priority Data:
2013-191465 17.09.2013 JP
(JA) グルーガン
Abstract: front page image
(EN)The present invention is provided with a melting part (40) for heating, melting, and discharging a rod-shaped hot-melt adhesive (50) introduced therein, the melting part (40) is formed of metal, and an introduction port (80a) for introducing the rod-shaped hot-melt adhesive (50) and a discharge port (83a) for discharging the heated and molten liquid hot-melt adhesive (50) are communicated by a plurality of passages (81b). The surface area of contact between the hot-melt adhesive (50) and the melting part (40) is thereby increased, and the hot-melt adhesive (50) can therefore be efficiently heated/melted, heated to a bonding temperature thereof in a short time, and discharged.
(FR)La présente invention concerne une partie fusion (40) pour chauffer, fondre et déverser un adhésif thermofusible en forme de tige (50) introduit dans cette dernière, la partie fusion (40) étant formée de métal ; un orifice d'introduction (80a) pour l'introduction de l'adhésif thermofusible en forme de tige (50) et un orifice de déversement (83a) pour déverser l'adhésif thermofusible liquide chauffé et fondu (50) communiquent par une pluralité de passages (81b). La surface de contact entre l'adhésif thermofusible (50) et la partie fusion (40) est ainsi augmentée, et l'adhésif thermofusible (50) peut donc être efficacement chauffé/fondu, chauffé jusqu'à sa température de collage en un laps de temps court et déversé.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)