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Pub. No.:    WO/2015/039048    International Application No.:    PCT/US2014/055704
Publication Date: 19.03.2015 International Filing Date: 15.09.2014
E04B 5/02 (2006.01), E04C 2/10 (2006.01), E04C 2/12 (2006.01)
Applicants: BEST WOODS INC. [US/US]; P.O. Box 10083 Napa, CA 94581 (US)
Inventors: YAU, Paul; (US)
Agent: BLIZZARD, Christopher; (US)
Priority Data:
61/998,281 23.06.2014 US
61/960,326 16.09.2013 US
Abstract: front page image
(EN)The present technology relates to connection joints for surface coverings which includes but is not limited to floor coverings and building panels. Embodiments of the present technology include connection joints that are strong and allow for the use of less material than is needed for tongue and groove connection joints. In embodiments related to floor coverings, these advantages are accomplished by reducing total thickness of a floor plank while increasing the thickness of the wear layer relative to the overall thickness of the floor plank and still be able to maintain a structurally strong connection joint.
(FR)La présente invention concerne des joints de raccordement pour des revêtements de surface qui comprennent, mais sans s'y limiter, des revêtements de sol et des panneaux de construction. Des modes de réalisation de la présente invention concernent des joints de raccordement, qui sont résistants et permettent d'utiliser moins de matériau que des joints de raccordement à languette et rainure. Dans des modes de réalisation concernant des revêtements de sol, ces avantages sont obtenus en réduisant l'épaisseur totale d'un madrier de sol tout en augmentant l'épaisseur de la couche d'usure par rapport à l'épaisseur globale du madrier de sol, et peut maintenir un joint de raccordement structurellement résistant.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)