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1. (WO2015038687) ANODIC BONDING OF THERMALLY STABLE POLYCRYSTALLINE MATERIALS TO SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/038687    International Application No.:    PCT/US2014/055047
Publication Date: 19.03.2015 International Filing Date: 11.09.2014
IPC:
E21B 10/42 (2006.01), E21B 10/46 (2006.01)
Applicants: HALLIBURTON ENERGY SERVICES, INC. [US/US]; 3000 N. Sam Houston Parkway E. Houston, Texas 77032 (US)
Inventors: ANDERLE, Seth Garrett; (US).
ATKINS, William Brian; (US)
Agent: RUSSELL, Dean W.; (US)
Priority Data:
61/876,260 11.09.2013 US
Title (EN) ANODIC BONDING OF THERMALLY STABLE POLYCRYSTALLINE MATERIALS TO SUBSTRATE
(FR) LIAISON ANODIQUE DE MATÉRIAUX POLYCRISTALLINS THERMIQUEMENT STABLES AVEC UN SUBSTRAT
Abstract: front page image
(EN)Cutting elements and other hardfacing components of a drill bit or other downhole equipment are provided that include a thermally stable polycrystalline material anodically bonded to a substrate. Methods and systems for making such elements and components are also provided.
(FR)La présente invention concerne des éléments de coupe et d'autres composants de surfaçage d'un trépan ou d'un autre équipement de fond de trou comprenant un matériau polycristallin thermiquement stable lié de façon anodique avec un substrat. La présente invention concerne également des procédés et des systèmes destinés à fabriquer de tels éléments et composants.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)