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Machine translation
1. (WO2015034757) CONSTRUCTION FOR AN IMPLANTABLE MEDICAL DEVICE EMPLOYING AN INTERNAL SUPPORT STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/034757    International Application No.:    PCT/US2014/053287
Publication Date: 12.03.2015 International Filing Date: 28.08.2014
IPC:
A61N 1/375 (2006.01)
Applicants: BOSTON SCIENTIFIC NEUROMODULATION CORPORATION [US/US]; 25155 Rye Canyon Loop Valencia, CA 91355 (US)
Inventors: BUNYAN, Navin, N.; (US).
TONG, Robert, R.; (US).
VAN FUNDERBURK, Jeffery; (US)
Agent: LEWIS, Terril, G.; (US)
Priority Data:
61/874,194 05.09.2013 US
14/469,822 27.08.2014 US
Title (EN) CONSTRUCTION FOR AN IMPLANTABLE MEDICAL DEVICE EMPLOYING AN INTERNAL SUPPORT STRUCTURE
(FR) CONSTRUCTION POUR DISPOSITIF MÉDICAL IMPLANTABLE EMPLOYANT UNE STRUCTURE DE SUPPORT INTERNE
Abstract: front page image
(EN)Disclosed are designs and methods of construction for an implantable medical device employing an internal support structure. The single-piece support structure holds various electronic components such as a communication coil and a circuit board, and further is affixed to a battery, thus providing a subassembly that is mechanically robust. The support structure further provides electrical isolation between these and other components. Method of construction allows for the subassembly to be adhered to a case of the implantable medical device at the support structure, and possibly also at the battery, without electrically shorting the battery to the case.
(FR)L'invention concerne des modèles et des procédés de construction pour un dispositif médical implantable employant une structure de support interne. La structure de support en une seule pièce supporte divers composants électroniques comme une bobine de communication et une carte de circuit imprimé, et est en outre reliée à une batterie, en formant ainsi un sous-ensemble qui est robuste au plan mécanique. La structure de support fournit en outre une isolation électrique entre ces composants et d'autres composants. Le procédé de construction permet de faire adhérer le sous-ensemble à un boîtier du dispositif médical implantable au niveau de la structure support, et éventuellement également au niveau de la batterie, sans court-circuit électrique entre la batterie et le boîtier.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)