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1. (WO2015034294) THERMOELECTRIC MODULE AND COOLING APPARATUS COMPRISING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/034294    International Application No.:    PCT/KR2014/008333
Publication Date: 12.03.2015 International Filing Date: 04.09.2014
IPC:
H01L 35/02 (2006.01), H01L 35/34 (2006.01)
Applicants: LG INNOTEK CO., LTD. [KR/KR]; Seoul Square 416, Hangang-daero, Jung-gu Seoul 100-714 (KR)
Inventors: KIM, Sang Gon; (KR).
CHO, Yong Sang; (KR).
WON, Boone; (KR).
LEE, Hyung Eui; (KR)
Agent: KIM, In Han; (KR)
Priority Data:
10-2013-0107384 06.09.2013 KR
Title (EN) THERMOELECTRIC MODULE AND COOLING APPARATUS COMPRISING SAME
(FR) MODULE THERMOÉLECTRIQUE ET APPAREIL DE REFROIDISSEMENT COMPRENANT CELUI-CI
(KO) 열전모듈 및 이를 포함하는 냉각장치
Abstract: front page image
(EN)Embodiments of the present invention relate to a thermoelectric module used for cooling, and provide a thermoelectric module comprising: substrates facing each other; and a first semiconductor element and a second semiconductor element arranged between the substrates and electrically connected to each other, wherein the first semiconductor element and the second semiconductor element have mutually different volumes. The present invention has a structure allowing the cooling effect to be raised by having, in a unit cell comprising thermoelectric semiconductor elements, any one from among the semiconductor elements facing each other to have a volume greater than the other to enhance the rise in electrical conductivity.
(FR)Des modes de réalisation de la présente invention concernent un module thermoélectrique utilisé pour le refroidissement. Selon l'invention, un module thermoélectrique comprend : des substrats se faisant face; et un premier et un second élément semi-conducteur disposés entre les substrats et connectés électriquement l'un à l'autre, le premier et le deuxième élément semi-conducteur ayant des volumes respectivement différents. La présente invention a une structure permettant d'augmenter l'effet de refroidissement du fait qu'elle possède, dans une cellule unité renfermant des éléments semi-conducteurs thermoélectriques, un élément quelconque choisi parmi les éléments semi-conducteurs se faisant face de manière à présenter un volume supérieur à un autre pour améliorer l'augmentation de la conductivité électrique.
(KO)본 발명의 실시예들은 넁각용으로 사용되는 열전모들에 관한 것으로, 상호 대향하는 기판을 포 함하고, 상기 기판 사이에 배치되며, 상호 전기적으로 연결되는 제 1반도체소자 및 제 2반도체소자를 포함하며, 상기 제 1반도체소자와 상기 제 2반도체소자의 체적이 상호 다른 것을 특징으로 하며, 열전 반도체소자를 형성하는 단위셀에서 상호 대향하는 반도체 소자증 어느 하나의 체적을 더 크게 형성하여 전기전도특성의 증진을 높임으로서, 넁각효을을 높일 수 있는 구조의 열전 모듈을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)