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Machine translation
1. (WO2015034287) SILVER ALLOY BONDING WIRE AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/034287    International Application No.:    PCT/KR2014/008323
Publication Date: 12.03.2015 International Filing Date: 04.09.2014
IPC:
C22C 5/06 (2006.01), H01L 21/301 (2006.01)
Applicants: MK ELECTRON CO., LTD. [KR/KR]; 405, Geumeo-ro, Pogok-eup Cheoin-gu, Yongin-si, Gyeonggi-do 449-812 (KR)
Inventors: KIM, Sang Yeob; (KR).
HEO, Young Il; (KR).
LEE, Jong Chul; (KR).
KIM, Seung Hyoun; (KR).
MOON, Jeong Tak; (KR)
Agent: Y.P.LEE, MOCK & PARTNERS; 12F Daelim Acrotel, 13 Eonju-ro 30-gil Gangnam-gu, Seoul 135-971 (KR)
Priority Data:
10-2013-0106291 04.09.2013 KR
Title (EN) SILVER ALLOY BONDING WIRE AND METHOD FOR MANUFACTURING SAME
(FR) FIL DE CONNEXION EN ALLIAGE D'ARGENT ET SON PROCÉDÉ DE FABRICATION
(KO) 은 합금 본딩 와이어 및 그의 제조 방법
Abstract: front page image
(EN)The present invention relates to a silver alloy bonding wire containing silver (Ag) as a main component, palladium (Pd), and gold (Au), and, more specifically, to an alloy bonding wire in which the palladium (Pd) content is 0.1 to 0.4 wt% and the weight content ratio of gold (Au) to palladium (Pd) is 0.25 to 1.0. The use of the silver alloy bonding wire of the present invention can improve the ball shape uniformity and the bonding ball shape of a ball which is formed on the tip of a wire and provide excellent reliability, loop linearity, and binding strength.
(FR)La présente invention concerne un fil de connexion en alliage d'argent contenant de l'argent (Ag) comme composant principal, du palladium (Pd) et du fer (Au), et, plus particulièrement, un fil de connexion en alliage dans lequel la teneur en palladium (Pd) est de 0,1 à 0,4 % en poids et le rapport de teneur pondérale de l'or (Au) sur le palladium (Pd) atteint 0,25 à 1,0. L'utilisation du fil de connexion en alliage d'argent de la présente invention permet d'améliorer l'uniformité de la forme de la bille et la forme de la bille de connexion d'une bille qui est formée sur l'extrémité d'un fil et de fournir une fiabilité, une linéarité de boucle et une résistance de connexion d'excellente qualité.
(KO)본 발명은 은(Ag)을 주성분으로 하고, 팔라듐(Pd) 및 금(Au)을 포함하는 은 합금 본딩 와이어에 관한 것으로서, 더욱 구체적으로는 팔라듐(Pd)의 함량이 0.1 내지 4.0 중량%이고, 팔라듐(Pd)에 대한 금(Au)의 중량기준 함량비가 0.25 내지 1.0인 은 합금 본딩 와이어에 관한 것이다. 본 발명의 은 합금 본딩 와이어를 이용하면 와이어 선단에 형성되는 볼의 볼모양 균일성과 본딩볼 형상이 개선되고 신뢰성, 루프 직진성, 및 접합 강도가 우수한 효과가 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)