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1. (WO2015033834) CURABLE COMPOSITION AND CONNECTION STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/033834    International Application No.:    PCT/JP2014/072422
Publication Date: 12.03.2015 International Filing Date: 27.08.2014
IPC:
C08L 71/10 (2006.01), C08F 290/06 (2006.01), C08F 299/04 (2006.01), C08G 59/17 (2006.01), C08L 63/00 (2006.01), H01B 1/00 (2006.01), H01B 1/22 (2006.01)
Applicants: SEKISUI CHEMICAL CO., LTD. [JP/JP]; 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565 (JP)
Inventors: ISHIZAWA, Hideaki; (JP).
KUBOTA, Takashi; (JP)
Agent: MIYAZAKI & METSUGI; Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028 (JP)
Priority Data:
2013-184417 05.09.2013 JP
2013-184418 05.09.2013 JP
Title (EN) CURABLE COMPOSITION AND CONNECTION STRUCTURE
(FR) COMPOSITION DURCISSABLE, ET STRUCTURE DE CONNEXION
(JA) 硬化性組成物及び接続構造体
Abstract: front page image
(EN)This invention provides a curable composition that uses a phenoxy resin that makes it possible to obtain a curable composition that, when cured, is highly adhesive in high-temperature, high-humidity environments. This curable composition contains conductive particles and a phenoxy resin that has a hydrolyzable group in a side chain.
(FR)L'invention fournit une composition durcissable qui met en œuvre une résine phenoxy destinée à obtenir une composition durcissable procurant un article durci dont les propriétés d'adhésion sont élevées sous une température et une humidité élevées. La composition durcissable de l'invention contient la résine phenoxy qui possède un groupe hydrolysable dans une chaîne latérale, et des particules conductrices.
(JA) 高温高湿下での接着性が高い硬化物を与える硬化性組成物を得ることができるフェノキシ樹脂を用いた硬化性組成物を提供する。 本発明に係る硬化性組成物は、加水分解性基を側鎖に有するフェノキシ樹脂と、導電性粒子とを含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)