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1. (WO2015029779) ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/029779    International Application No.:    PCT/JP2014/071358
Publication Date: 05.03.2015 International Filing Date: 13.08.2014
IPC:
B32B 7/02 (2006.01), G06F 3/041 (2006.01), H01B 5/14 (2006.01), H01B 13/00 (2006.01)
Applicants: FUJIFILM CORPORATION [JP/JP]; 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620 (JP)
Inventors: ICHIKI Akira; (JP).
TONOIKE Nozomu; (JP)
Agent: CHIBA Yoshihiro; (JP)
Priority Data:
2013-180644 30.08.2013 JP
Title (EN) ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME
(FR) FILM ÉLECTROCONDUCTEUR ET PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) 導電性フィルム及びその製造方法
Abstract: front page image
(EN) The present invention pertains to an electroconductive film and a method for manufacturing the electroconductive film. An electroconductive film having an insulating substrate (32A) and an electrode part (36A) comprising a thin metal wire (52) disposed on the surface of the insulating substrate (32A), wherein the width of the thin metal wire (52) varies, the difference between the maximum wire width (Wmax) and the minimum wire width (Wmin) of the thin metal wire (52) is 20% to less than 75% of the average wire width (Wave) of the thin metal wire (52), and the average wire width (Wave) is 1-7 μm.
(FR) La présente invention concerne un film électroconducteur et un procédé de fabrication de celui-ci. L'invention concerne un film électroconducteur ayant un substrat isolant (32A) et une pièce d'électrode (36A) comportant un fil métallique fin (52) disposé sur la surface du substrat isolant (32A), dans lequel la largeur du fil métallique fin (52) varie, la différence entre la largeur maximum de fil (Wmax) et la largeur minimum de fil (Wmin) du fil métallique fin (52) est comprise entre 20 % et moins de 75 % de la largeur moyenne de fil (onde) du fil métallique fin (52), et la largeur moyenne de fil (onde) est comprise entre 1 et 7 μm.
(JA) 本発明は導電性フィルム及びその製造方法に関する。絶縁基体(32A)と、該絶縁基体(32A)の表面に配置された金属細線(52)による電極部(36A)とを有する導電性フィルムにおいて、金属細線(52)の線幅が変動しており、金属細線(52)の最大線幅(Wmax)と最小線幅(Wmin)の差が、金属細線(52)の平均線幅(Wave)の20%以上75%未満であり、平均線幅(Wave)が1μm以上7μm以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)