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1. (WO2015029478) METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/029478    International Application No.:    PCT/JP2014/056534
Publication Date: 05.03.2015 International Filing Date: 12.03.2014
IPC:
H05K 3/26 (2006.01), C04B 37/02 (2006.01), C04B 41/91 (2006.01), H01L 23/12 (2006.01), H05K 3/06 (2006.01), H05K 3/38 (2006.01)
Applicants: HITACHI METALS, LTD. [JP/JP]; 2-70, Konan 1-chome, Minato-ku, Tokyo 1088224 (JP)
Inventors: CHIWATA Nobuhiko; (JP)
Agent: TAKAISHI Kitsuma; Kagurazaka FN Bldg. 5F, 67, Kagurazaka 6-chome, Shinjuku-ku, Tokyo 1620825 (JP)
Priority Data:
2013-177709 29.08.2013 JP
Title (EN) METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
(FR) PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT CÉRAMIQUE
(JA) セラミックス回路基板の製造方法
Abstract: front page image
(EN)A method for manufacturing a ceramic circuit board, which comprises: a bonding step wherein a metal plate is bonded to a ceramic substrate with a brazing material being interposed therebetween, thereby obtaining a bonded body; and a pattern forming step wherein the bonded metal plate is subjected to etching, thereby forming a circuit pattern. This method for manufacturing a ceramic circuit board is characterized in that: the brazing material contains Ag; and this method also comprises a step wherein the substrate provided with the circuit pattern is further etched using an acidic solution that contains a carboxylic acid and/or a carboxylic acid salt together with hydrogen peroxide, thereby removing unnecessary brazing material.
(FR)L'invention concerne un procédé de fabrication de carte de circuit céramique, comprenant les étapes suivantes : collage d'une plaque métallique avec un substrat de céramique en interposant entre eux un matériau de brasure, permettant d'obtenir un corps collé ; formation d'un motif, la plaque métallique collée étant soumise à une gravure, permettant de former un motif de circuit. Ce procédé de fabrication de carte de circuit céramique est caractérisé en ce que le matériau de brasure contient de l'Ag, et en ce qu'il comprend en outre une étape de gravure supplémentaire du substrat pourvu du motif de circuit en utilisant une solution acide contenant un acide carboxylique et/ou un sel d'acide carboxylique en même temps que du peroxyde d'hydrogène, permettant de retirer le matériau de brasure inutile.
(JA) セラミックス基板にロウ材を介して金属板を接合して接合体を得る接合工程と、前記接合した金属板をエッチングして回路パターンを形成するパターン形成工程とを有するセラミックス回路基板の製造方法であって 前記ロウ材がAgを含み、 前記回路パターンを形成した基板を、さらにカルボン酸及び/又はカルボン酸塩、並びに過酸化水素を含む酸性の溶液でエッチングして不要なロウ材を除去する工程を有することを特徴とするセラミックス回路基板の製造方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)