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1. (WO2015027709) CHIP MANUFACTURING DEVICE AND METHOD FOR CHIP MANUFACTURING USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/027709    International Application No.:    PCT/CN2014/075174
Publication Date: 05.03.2015 International Filing Date: 11.04.2014
IPC:
G05B 19/04 (2006.01)
Applicants: APEX MICROELECTRONICS COMPANY LIMITED [CN/CN]; 7/F Building 04, NO.63,Mingzhubei Road, Xiangzhou District Zhuhai, Guangdong 519075 (CN)
Inventors: QI, Meichao; (CN).
LIU, Jinxin; (CN).
LOU, Peng; (CN).
ZHOU, Bin; (CN).
CHEN, Hao; (CN)
Agent: LEADER PATENT & TRADEMARK FIRM; 8F-6,Bldg. A,Winland International Center,No. 32 Xizhimen North Street, Haidian District Beijing 100082 (CN)
Priority Data:
201310379253.X 27.08.2013 CN
Title (EN) CHIP MANUFACTURING DEVICE AND METHOD FOR CHIP MANUFACTURING USING SAME
(FR) DISPOSITIF DE FABRICATION DE PUCE ET PROCÉDÉ DE FABRICATION DE PUCE L'UTILISANT
(ZH) 芯片加工装置以及应用芯片加工装置进行芯片加工的方法
Abstract: front page image
(EN)Provided are a chip manufacturing device and method for chip manufacturing using the same, the device having, for various types of chips, one or more functions of burning, testing, identifying, and resetting or diagnosing. The various types of chips have different communication interfaces, and/or use different communication protocols. The chip manufacturing device can burn, test, identify, and reset or diagnose chips after obtaining the model of chips to be manufactured, thus having high universality.
(FR)L'invention concerne un dispositif de fabrication de puce et un procédé de fabrication de puce l'utilisant, le dispositif comportant, pour divers types de puces, une ou plusieurs fonctions de cuisson, d'essai, d'identification et de réinitialisation ou de diagnostic. Les divers types de puces ont des interfaces de communication différentes, et/ou utilisent des protocoles de communication différents. Le dispositif de fabrication de puce peut cuire, essayer, identifier, et réinitialiser ou diagnostiquer des puces après l'obtention du modèle des puces à fabriquer, présentant ainsi une universalité élevée.
(ZH)本发明提供一种芯片加工装置以及应用芯片加工装置进行芯片加工的方法,同时具备烧录、检测、识别、复位或诊断功能中的一种或者几种,其可以烧录、检测、复位或诊断多种芯片,所述多种芯片具有不同通信接口,和/或使用不同的通信协议。所述芯片加工装置可用于在获取待加工芯片的型号之后对芯片进行烧录、检测、识别、复位或诊断,具有较高的通用性。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)