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1. WO2015021202 - FORMING A CONDUCTIVE IMAGE USING HIGH SPEED ELECTROLESS PLATIN

Publication Number WO/2015/021202
Publication Date 12.02.2015
International Application No. PCT/US2014/050011
International Filing Date 06.08.2014
IPC
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
54
Contact plating, i.e. electroless electrochemical plating
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
C23C 18/54 (2006.01)
C23C 18/18 (2006.01)
H05K 3/10 (2006.01)
CPC
C03C 17/10
C23C 18/06
C23C 18/143
C23C 18/1608
C23C 18/1612
C23C 18/1633
Applicants
  • EARTHONE CIRCUIT TECHNOLOGIES CORPORATION [US/US]; 2236 Rutherford Road, Suite 119 Carlsbad, California 92008, US
Inventors
  • WISMANN, William; US
Agents
  • KAINOA ASUEGA; One LLP 4000 Macarthur Boulevard East Tower, Suite 500 Newport Beach, California 92660, US
Priority Data
61/862,92406.08.2013US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FORMING A CONDUCTIVE IMAGE USING HIGH SPEED ELECTROLESS PLATIN
(FR) FORMATION D'UNE IMAGE CONDUCTRICE À L'AIDE D'UN DÉPÔT AUTOCATALYTIQUE À VITESSE ÉLEVÉE
Abstract
(EN)
A method of producing a conductive image using high speed electroless plating according to the present invention preferably includes the steps of: preparing the surface of a substrate; depositing a metal coordination complex into the surface of the substrate; reducing the metal coordination complex to form an image in the surface of the substrate; depositing a protective material onto the image; electrolessly plating metal onto the image.
(FR)
La présente invention concerne un procédé de production d'une image conductrice à l'aide d'un dépôt autocatalytique à vitesse élevée, ledit procédé comprenant de préférence les étapes consistant à : préparer la surface d'un substrat; déposer un complexe de coordination métallique à l'intérieur de la surface du substrat; réduire le complexe de coordination métallique en vue de former une image dans la surface du substrat; déposer une substance protectrice sur l'image; déposer de manière autocatalytique le métal sur l'image.
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