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1. WO2015012694 - OPTICAL SUBASSEMBLY, OPTICAL SYSTEM AND METHOD

Publication Number WO/2015/012694
Publication Date 29.01.2015
International Application No. PCT/NL2014/050510
International Filing Date 24.07.2014
IPC
G02B 6/30 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
26Optical coupling means
30for use between fibre and thin-film device
G02B 6/42 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
G02B 6/36 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
36Mechanical coupling means
CPC
G02B 6/12002
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
12002Three-dimensional structures
G02B 6/13
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
13Integrated optical circuits characterised by the manufacturing method
G02B 6/30
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
26Optical coupling means
30for use between fibre and thin-film device
G02B 6/3652
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
36Mechanical coupling means
3628for mounting fibres to supporting carriers
3648Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
3652the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
G02B 6/423
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
423using guiding surfaces for the alignment
G02B 6/4239
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
4236Fixing or mounting methods of the aligned elements
4239Adhesive bonding; Encapsulation with polymer material
Applicants
  • EFFECT PHOTONICS B.V. [NL]/[NL]
Inventors
  • MUSK, Robert William
Agents
  • NEDERLANDSCH OCTROOIBUREAU
Priority Data
13177770.824.07.2013EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) OPTICAL SUBASSEMBLY, OPTICAL SYSTEM AND METHOD
(FR) SOUS-ENSEMBLE OPTIQUE, SYSTÈME OPTIQUE ET PROCÉDÉ
Abstract
(EN)
The invention relates to an optical subassembly (1) comprising a carrier substrate(2), a photonic integrated circuit (3) (PIC) comprising a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) comprising a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than10µm. The invention also relates to an optical system(12) comprising an optical subassembly according to the invention and to a method of fabricating an optical subassembly according to the invention.
(FR)
La présente invention concerne un sous-ensemble optique (1) comprenant un substrat de support (2), un circuit intégré photonique (PIC) (3) comprenant un premier guide d'onde optique (4) possédant un premier axe central longitudinal, le PIC étant agencé sur le substrat de support, un système optique externe (5) comprenant un second guide d'onde optique (6) possédant un second axe central longitudinal, un élément (7) permettant de soutenir le système optique externe sur le substrat de support et de maintenir l'alignement des premier et second axes centraux longitudinaux l'un par rapport à l'autre, et un matériau adhésif (8, 9) étant agencé entre l'élément et le substrat de support et entre l'élément et le système optique externe, le matériau adhésif possédant une épaisseur totale inférieure à 10 µm. L'invention concerne également un système optique (12) comprenant un sous-ensemble optique selon l'invention ainsi qu'un procédé de fabrication d'un sous-ensemble optique selon l'invention.
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