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1. WO2015008586 - SUBSTRATE MANUFACTURING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD

Publication Number WO/2015/008586
Publication Date 22.01.2015
International Application No. PCT/JP2014/066633
International Filing Date 24.06.2014
IPC
G09F 9/00 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
B24B 37/00 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
CPC
B24B 37/042
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
042operating processes therefor
G06F 1/16
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
G06F 1/1613
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
H05K 2203/016
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0147Carriers and holders
016Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
H05K 3/0044
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0044Mechanical working of the substrate, e.g. drilling or punching
H05K 3/0055
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0055After-treatment, e.g. cleaning or desmearing of holes
Applicants
  • ソニー株式会社 SONY CORPORATION [JP]/[JP]
Inventors
  • 赤阪 慎 AKASAKA, Shin
  • 公文 哲史 KUMON, Satoshi
  • 佐藤 健太郎 SATOU, Kentarou
  • 大石 雄紀 OISHI, Yuki
Agents
  • 特許業務法人つばさ国際特許事務所 TSUBASA PATENT PROFESSIONAL CORPORATION
Priority Data
2013-14774116.07.2013JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE MANUFACTURING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD
(FR) PROCÉDÉ DE FABRICATION D'UN SUBSTRAT ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF ÉLECTRONIQUE
(JA) 基板の製造方法および電子デバイスの製造方法
Abstract
(EN)
Disclosed is a substrate manufacturing method that includes: a step for polishing a surface of a material substrate; and a step for forming a planarization film on the surface of the material substrate after polishing the surface of the material substrate.
(FR)
L'invention se rapporte à un procédé de fabrication d'un substrat, qui comprend : une étape de polissage d'une surface d'un substrat matériel ; et une étape formation d'un film de planarisation sur la surface dudit substrat matériel après le polissage de ladite surface dudit substrat matériel.
(JA)
 素材基板の表面を研磨することと、前記素材基板の表面を研磨したのちに、前記素材基板の表面に平坦化膜を形成することとを含む基板の製造方法。
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