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1. (WO2014210307) CO-INTEGRATED BULK ACOUSTIC WAVE RESONATORS

Pub. No.:    WO/2014/210307    International Application No.:    PCT/US2014/044335
Publication Date: Thu Jan 01 00:59:59 CET 2015 International Filing Date: Fri Jun 27 01:59:59 CEST 2014
IPC: H03H 9/15
Applicants: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
Inventors: EDREES, Hassan
KYMISSIS, Ioannis
KINGET, Peter
Title: CO-INTEGRATED BULK ACOUSTIC WAVE RESONATORS
Abstract:
An electrical circuit assembly can include a semiconductor integrated circuit, such as fabricated including CMOS devices. A first lateral-mode resonator can be fabricated upon a surface of the semiconductor integrated circuit, such as including a deposited acoustic energy storage layer including a semiconductor material, a deposited piezoelectric layer acoustically coupled to the deposited acoustic energy storage layer, and a first conductive region electrically coupled to the deposited piezoelectric layer and electrically coupled to the semiconductor integrated circuit. The semiconductor integrated circuit can include one or more transistor structures, such as fabricated prior to fabrication of the lateral-mode resonator. Fabrication of the lateral-mode resonator can include low-temperature processing specified to avoid disrupting operational characteristics of the transistor structures.