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1. (WO2014208737) HEAT-CURABLE COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD

Pub. No.:    WO/2014/208737    International Application No.:    PCT/JP2014/067210
Publication Date: Thu Jan 01 00:59:59 CET 2015 International Filing Date: Sat Jun 28 01:59:59 CEST 2014
IPC: C08G 59/68
H05K 1/03
Applicants: TAIYO INK MFG. CO., LTD.
太陽インキ製造株式会社
Inventors: CHUJO Takayuki
中条 貴幸
ENDO Arata
遠藤 新
Title: HEAT-CURABLE COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD
Abstract:
The purpose of the present invention is to provide: a heat-curable composition which enables the production of a cured article that does not undergo cracking during a cooling/heating cycle; a dry film produced using the heat-curable composition; and a printed wiring board which is equipped with the cured article. A heat-curable composition characterized by comprising a semisolid or solid epoxy compound and a curing accelerator that can be solubilized in the epoxy resin when heated to 130 to 220˚C; a dry film which has a resin layer formed from the heat-curable composition; and a printed wiring board which is equipped with a cured article produced from one of the aforementioned products.