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1. (WO2014208406) PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME AND PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/208406 International Application No.: PCT/JP2014/066077
Publication Date: 31.12.2014 International Filing Date: 17.06.2014
IPC:
G03F 7/031 (2006.01) ,G03F 7/004 (2006.01) ,H05K 3/28 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
031
Organic compounds not covered by group G03F7/02967
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants: TAIYO INK MFG. CO., LTD.[JP/JP]; 900, Oaza Hirasawa, Ranzan-machi, Hiki-gun, Saitama 3550215, JP
Inventors: MATSUMOTO Shigeru; JP
NORIKOSHI Akio; JP
KONDO Shinobu; JP
Agent: HONDA Ichiro; JP
Priority Data:
2013-13693828.06.2013JP
2014-01849203.02.2014JP
Title (EN) PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME AND PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE PHOTO-DURCISSABLE, PRODUIT DURCI ISSU DE CELLE-CI ET CARTE À CIRCUIT IMPRIMÉ
(JA) 光硬化性樹脂組成物、その硬化物およびプリント配線板
Abstract:
(EN) The purpose of the present invention is to provide: a photocurable resin composition which is suppressed in the generation of an outgas; a cured product which is obtained by curing this photocurable resin composition; and a printed wiring board which is provided with this cured product. A photocurable resin composition which contains a carboxyl group-containing resin, a compound that has two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator that is represented by general formula (I). (In the formula, R represents a structure represented by formula (II); l1 represents an integer of 2-4; and m1 represents an integer of 1 or more.)
(FR) La présente invention concerne : une composition de résine photo-durcissable caractérisé par la limitation de la génération d'un dégazement; un produit durci obtenu en durcissant cette composition de résine photo-durcissable; et une carte à circuit imprimé comportant ledit produit durci. Une composition de résine photo-durcissable selon l'invention contient une résine contenant un groupe carboxyle, un composé comprenant au moins deux groupes à insaturation éthylénique dans chaque molécule, et un initiateur de photo-polymérisation représenté par la formule générale (I). (Dans la formule, R représente une structure représentée par la formule (II); l1 représente un entier de 2 à 4; et m1 représente un entier valant au moins 1.)
(JA)  アウトガスの発生が抑制された光硬化性樹脂組成物、それを硬化してなる硬化物、および、それを備えるプリント配線板を提供することを目的とする。 カルボキシル基含有樹脂、分子中に2個以上のエチレン性不飽和基を有する化合物、および、下記一般式(I)で表される光重合開始剤、を含有する光硬化性樹脂組成物である。(式中、Rは下記式(II)で示される構造を表し、lは2~4の整数、mは1以上の整数を表す。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)