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1. (WO2014208131) EPOXY COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD

Pub. No.:    WO/2014/208131    International Application No.:    PCT/JP2014/054919
Publication Date: Thu Jan 01 00:59:59 CET 2015 International Filing Date: Fri Feb 28 00:59:59 CET 2014
IPC: C08G 59/06
C07D 301/28
C07D 407/14
H01L 23/29
H01L 23/31
Applicants: DIC CORPORATION
DIC株式会社
Inventors: SATOU Yutaka
佐藤 泰
TAKAHASHI Ayumi
高橋 歩
Title: EPOXY COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
Abstract:
Provided are: an epoxy compound having superior heat resistance and flame resistance of the cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and cured product thereof; and a semiconductor sealing material. The epoxy compound is characterized by having a diarylene[b,d]furan structure, at least one of two arylene groups having a naphthalene skeleton, and both the arylene groups having a glycidyloxy group on the aromatic nucleus thereof.