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1. (WO2014207619) FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARABLE CHIPS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/207619 International Application No.: PCT/IB2014/062346
Publication Date: 31.12.2014 International Filing Date: 18.06.2014
IPC:
B01L 3/00 (2006.01) ,B81C 1/00 (2006.01) ,G01N 33/487 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
01
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
L
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
3
Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
33
Investigating or analysing materials by specific methods not covered by groups G01N1/-G01N31/131
48
Biological material, e.g. blood, urine; Haemocytometers
483
Physical analysis of biological material
487
of liquid biological material
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION[US/US]; New Orchard Road Armonk, New York 10504, US
IBM RESEARCH GMBH[CH/CH]; IBM Research - Zurich Saeumerstrasse 4 CH-8803 Rueschlikon, CH (MG)
Inventors: DELAMARCHE, Emmanuel; CH
TEMIZ, Yuksel; CH
Agent: RAGOT, Sébastien; IBM Research GmbH IBM Research - Zurich Intellectual Property Law Saeumerstrasse 4 CH-8803 Rueschlikon, CH
Priority Data:
1311680.128.06.2013GB
Title (EN) FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARABLE CHIPS
(FR) FABRICATION D'UN BOÎTIER OU D'UN ENSEMBLE DE PUCES MICROFLUIDIQUES COMPRENANT DES PUCES SÉPARABLES
Abstract:
(EN) The present invention is notably directed to methods of fabrication of a microfluidic chip package or assembly (1), comprising: providing (S1) a substrate (10, 30) having at least one block (14, 14a) comprising one or more microfluidic structures on a face (F) of the substrate; partially cutting (S2) into the substrate to obtain partial cuts (10c), such that a residual 6 thickness of the substrate at the level of the partial cuts (10c) enables singulation of said at least one block (14, 14a); cleaning (S4) said at least one block; and applying (S5 – S7) a cover-film (62) to cover said at least one block (14, 14a), whereby at least one covered block is obtained, the applied cover film still enabling singulation of each covered block, wherein each covered block corresponds to a microfluidic chip after singulation. The present invention is further directed to microfluidic chips, packing or assembly, obtainable with such 12 methods.
(FR) La présente invention concerne notamment des procédés de fabrication d'un boîtier ou d'un ensemble de puces microfluidiques (1) comprenant: la fourniture (S1) d'un substrat (10, 30) comprenant au moins un bloc (14, 14a) comprenant une ou plusieurs structures microfluidiques sur une face (F) du substrat; la découpe partielle (S2) dans le substrat pour obtenir des découpes partielles (10c) de sorte qu'une épaisseur résiduelle du substrat au niveau des découpes partielles (10c) permette la séparation dudit/desdits bloc(s) (14, 14a); le nettoyage (S4) dudit/desdits bloc(s); et l'application (S5 - S7) d'un film de couverture (62) permettant de recouvrir ledit/lesdits bloc(s) (14, 14a), au moins un bloc recouvert étant obtenu, le film de couverture appliqué permettant toujours la séparation de chaque bloc recouvert, chaque bloc recouvert correspondant à une puce microfluidique après la séparation. La présente invention concerne également un boîtier ou un ensemble de puces microfluidiques pouvant être obtenu grâce à de tels procédés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)