Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2014206460) SWITCHED MODE POWER SUPPLY MODULE AND METHOD OF MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/206460 International Application No.: PCT/EP2013/063382
Publication Date: 31.12.2014 International Filing Date: 26.06.2013
IPC:
H01L 23/367 (2006.01) ,H02M 7/00 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7
Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) [SE/SE]; S-164 83 Stockholm, SE
Inventors:
PERSSON, Oscar; SE
HÖRMAN, Johan; SE
KARLSSON, Magnus; SE
SCHURMANN, Peter; SE
Agent:
HOFFMANN · EITLE; David Sproston Arabellastrasse 30 81925 Munich, DE
Priority Data:
Title (EN) SWITCHED MODE POWER SUPPLY MODULE AND METHOD OF MANUFACTURING THE SAME
(FR) MODULE D'ALIMENTATION ÉLECTRIQUE EN MODE COMMUTÉ ET SON PROCÉDÉ DE FABRICATION
Abstract:
(EN) The disclosure relates to a method of manufacturing a switched-mode power supply module. The method comprises providing a printed circuit board. The board has conductive traces on at least a first side. The conductive traces on at least the first side are electronically connected to at least one inductive winding formed around an aperture connecting the first side and the second side. The method comprises inserting a magnetic core into the aperture from the first side to the second side. The method comprises securing the magnetic core at the first side. The method comprises mounting at least one switching element on the first side so as to be electrically connected to the conductive traces. The method comprises providing a thermally conductive heatsink to the magnetic core on the first side of the printed circuit board. Also disclosed is a switched-mode power supply module manufacturable by the disclosed method.
(FR) L'invention porte sur un procédé de fabrication d'un module d'alimentation électrique en mode commuté. Le procédé consiste à produire une carte de circuit imprimé. La carte a des traces conductrices sur au moins un premier côté. Les traces conductrices sur au moins le premier côté sont électroniquement connectées à au moins un enroulement inductif formé autour d'un orifice connectant le premier côté et le second côté. Le procédé consiste à insérer un noyau magnétique dans l'orifice depuis le premier côté vers le second côté. Le procédé consiste à fixer le noyau magnétique du premier côté. Le procédé consiste à monter au moins un élément commutateur du premier côté de manière à être électriquement connecté aux traces conductrices. Le procédé consiste à équiper le noyau magnétique d'un dissipateur thermique thermiquement conducteur sur le premier côté de la carte de circuit imprimé. L'invention concerne également un module d'alimentation électrique en mode commuté pouvant être fabriqué par le procédé selon l'invention.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)