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1. (WO2014205983) MANUFACTURING METHOD FOR VIA HOLE, MANUFACTURING METHOD FOR DISPLAY PANEL, AND DISPLAY PANEL
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/205983 International Application No.: PCT/CN2013/087330
Publication Date: 31.12.2014 International Filing Date: 18.11.2013
IPC:
H01L 21/44 (2006.01) ,H01L 27/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
34
the devices having semiconductor bodies not provided for in groups H01L21/06, H01L21/16, and H01L21/18159
44
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/36-H01L21/428158
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02
including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12
the substrate being other than a semiconductor body, e.g. an insulating body
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
北京京东方光电科技有限公司 BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国北京市 经济技术开发区西环中路8号 No.8 Xihuanzhonglu, BDA Beijing 100176, CN
Inventors:
李田生 LI, Tiansheng; CN
谢振宇 XIE, Zhenyu; CN
Agent:
北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES; 中国北京市海淀区彩和坊路10号1号楼10层 10th Floor, Building 1, 10 Caihefang Road, Haidian District Beijing 100080, CN
Priority Data:
201310264196.027.06.2013CN
Title (EN) MANUFACTURING METHOD FOR VIA HOLE, MANUFACTURING METHOD FOR DISPLAY PANEL, AND DISPLAY PANEL
(FR) PROCÉDÉ DE FABRICATION D'UN TROU TRAVERSANT, PROCÉDÉ DE FABRICATION D'UN PANNEAU D'AFFICHAGE ET PANNEAU D'AFFICHAGE
(ZH) 过孔制作方法、显示面板制作方法及显示面板
Abstract:
(EN) A manufacturing method for a via hole of a display panel, a manufacturing method for a display panel, and a display panel. During forming of a via hole, according to a value of a required slope angle, a film layer at the top of an area which is above a circuit pattern and in which the via hole needs to be generated is etched by using a first etching condition; and according to a required selectivity, a remaining part of the area in which the via hole needs to be generated is etched by using a second etching condition, so as to form a final via hole, thereby avoiding problems that the slope angle and selectivity cannot be set freely in a one-step etching method.
(FR) L'invention porte sur un procédé de fabrication d'un trou traversant d'un panneau d'affichage, sur un procédé de fabrication d'un panneau d'affichage et sur un panneau d'affichage. Pendant la formation d'un trou traversant, selon une valeur d'un angle de pente requis, une couche de film au niveau du sommet d'une zone qui est au-dessus d'un motif de circuit et dans laquelle le trou traversant doit être généré est gravée par utilisation d'une première condition de gravure; selon une sélectivité requise, une partie restante de la zone dans laquelle le trou traversant doit être généré est gravée par utilisation d'une seconde condition de gravure, afin de former un trou traversant final, empêchant ainsi des problèmes selon lesquels l'angle de pente et la sélectivité ne peuvent pas être réglés librement dans un procédé de gravure à une étape.
(ZH) 一种显示面板过孔制作方法、显示面板制作方法及显示面板,在形成过孔时,根据所需坡度角的大小,采用第一刻蚀条件对电路图案上方需要生成过孔的区域中位于顶层的膜层进行刻蚀;根据所需选择比,采用第二刻蚀条件对需要生成过孔区域中的剩余部分进行刻蚀,形成最终的过孔,避免一步法刻蚀中坡度角与选择比不能自由设置的问题。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)