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Pub. No.: WO/2014/205764 International Application No.: PCT/CN2013/078326
Publication Date: 31.12.2014 International Filing Date: 28.06.2013
H05K 3/28 (2006.01)
Applicants: AU OPTRONICS CORPORATION[CN/CN]; No.1 Li-Hsin Road 2, Science-Based Industrial Park Hsin-Chu, Taiwan, CN
Inventors: HUANG, Annie, Tzuyu; CN
HUNG, Shihhsing; CN
Agent: LECOME INTELLECTUAL PROPERTY AGENT LTD.; Floor. 16, Tower B of Indo Mansion No. 48-Jia Zhichun Road, Haidian District Beijing 100098, CN
Priority Data:
(ZH) 软性电子装置
Abstract: front page image
(EN) Disclosed is a flexible electronic device which comprises a flexible substrate, an electronic component layer and a protective film, wherein the electronic component layer is arranged on an upper surface of the flexible substrate, and the protective film is arranged on the upper surface of the flexible substrate and covers the electronic component layer. At least one side wall of the protective film intersects with the upper surface of the flexible substrate, and an included angle formed by the side wall and the upper surface of the flexible substrate is an acute angle.
(FR) La présente invention concerne un dispositif électronique flexible comprenant un substrat flexible, une couche de composant électronique et un film protecteur, la couche de composant électronique étant agencée sur une surface supérieure du substrat flexible, et le film protecteur étant agencé sur la surface supérieure du substrat flexible et recouvrant la couche de composant électronique. Au moins une paroi latérale du film protecteur coupe la surface supérieure du substrat flexible, et un angle inclus formé par la paroi latérale et la surface supérieure du substrat flexible est un angle aigu.
(ZH) 本发明公开一种软性电子装置,其包括软性基板、一电子元件层以及保护膜,其中电子元件层设置于软性基板的上表面,保护膜设置于软性基板的上表面且覆盖电子元件层。保护膜具有至少一侧壁与软性基板的上表面相交,且侧壁与软性基板上表面的夹角为锐角。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)