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1. (WO2014205385) WAFER INSPECTION USING FREE-FORM CARE AREAS

Pub. No.:    WO/2014/205385    International Application No.:    PCT/US2014/043473
Publication Date: Thu Dec 25 00:59:59 CET 2014 International Filing Date: Sat Jun 21 01:59:59 CEST 2014
IPC: H01L 21/66
H01L 21/00
Applicants: KLA-TENCOR CORPORATION
Inventors: WU, Kenong
LUO, Tao
GAO, Lisheng
SHIFRIN, Eugene
BALAJI, Aravindh
Title: WAFER INSPECTION USING FREE-FORM CARE AREAS
Abstract:
Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.