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1. (WO2014204448) CONFIRM PROPER SEATING OF A DUAL INLINE MEMORY MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/204448 International Application No.: PCT/US2013/046401
Publication Date: 24.12.2014 International Filing Date: 18.06.2013
IPC:
G06F 1/16 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
Applicants:
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP [US/US]; 11445 Compaq Center Drive West Houston, TX 77070, US
Inventors:
NORTON, John; US
KEEF, Timothy; US
Agent:
DEVITO, Victor; Hewlett Packard Enterprise 3404 E. Harmony Road Mail Stop 79 Fort Collins, CO 80528, US
Priority Data:
Title (EN) CONFIRM PROPER SEATING OF A DUAL INLINE MEMORY MODULE
(FR) CONFIRMATION DE LA PORTÉE CORRECTE D'UN MODULE DE MÉMOIRE À DOUBLE RANGÉE DE CONNEXIONS
Abstract:
(EN) A server system includes a dual in-line memory module, a dual inline memory module baffle, a hood, and a chassis. The dual inline memory module baffle includes a set of dual inline memory module engagement members. The hood includes a first set of hood engagement members. The chassis includes a first set of chassis engagement members and a second set of chassis engagement members.
(FR) L'invention concerne un système de serveur comprenant un module de mémoire à double rangée de connexions, une paroi pour module de mémoire à double rangée de connexions, un capot et un châssis. La paroi pour module de mémoire à double rangée de connexions comprend un ensemble d'organes d'enclenchement de module de mémoire à double rangée de connexions. Le capot comprend un premier ensemble d'organes d'enclenchement de capot. Le châssis comprend un premier ensemble d'organes d'enclenchement de châssis et un deuxième ensemble d'organes d'enclenchement de châssis.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)