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1. (WO2014204204) CONDUCTIVE HEAT-DISSIPATING SHEET, AND ELECTRICAL PARTS AND ELECTRONIC DEVICES COMPRISING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/204204    International Application No.:    PCT/KR2014/005363
Publication Date: 24.12.2014 International Filing Date: 18.06.2014
IPC:
H05K 7/20 (2006.01), H05K 9/00 (2006.01)
Applicants: ILJIN MATERIALS CO., LTD. [KR/KR]; 63-25, Seogam-ro 3-gil Iksan-si, Jeollabuk-do 570-998 (KR)
Inventors: YANG, Jeom Sik; (KR).
BEOM, Won Jin; (KR).
SONG, Ki Deok; (KR).
SONG, Jin Su; (KR).
HAN, In Kyu; (KR).
RYU, Jong Ho; (KR)
Agent: CHOI, Hunsik; Kanghan International Patent Law & Firm (KolonDigitalTowerAston Bldg, Gasan-dong) #707, 212 Gasandigital 1-ro, Geumcheon-gu Seoul 153-708 (KR)
Priority Data:
10-2013-0070497 19.06.2013 KR
10-2014-0073692 17.06.2014 KR
Title (EN) CONDUCTIVE HEAT-DISSIPATING SHEET, AND ELECTRICAL PARTS AND ELECTRONIC DEVICES COMPRISING SAME
(FR) FEUILLE CONDUCTRICE DE DISSIPATION DE CHALEUR, ET PIÈCES ÉLECTRIQUES ET DISPOSITIFS ÉLECTRONIQUES LA COMPRENANT
(KO) 도전성 방열시트, 이를 포함하는 전기부품 및 전자제품
Abstract: front page image
(EN)Disclosed herein are a conductive heat-dissipating sheet comprising a heat diffusion layer formed using metal materials; a heat conduction layer which is disposed on one surface or both surfaces of the heat diffusion layer and which is formed using inorganic materials including at least one material from the group consisting of metal oxides and alloys; and an adhesive layer disposed on one surface or both surfaces of the heat conduction layer; and an electrical part and an electronic device comprising the conductive heat-dissipating sheet.
(FR)La présente invention concerne une feuille conductrice de dissipation de chaleur comprenant une couche de diffusion de chaleur formée à partir de matériaux métalliques ; une couche de conduction de chaleur qui est disposée sur une surface ou sur les deux surfaces de la couche de diffusion de chaleur et qui est formée à partir de matériaux inorganiques comprenant au moins un matériau du groupe comprenant les oxydes de métaux et les alliages ; et une couche adhésive agencée sur une surface ou sur les deux surfaces de la couche de conduction de chaleur ; et une pièce électrique et un dispositif électronique comprenant la feuille conductrice de dissipation de chaleur.
(KO)본 발명은 금속재료에 의하여 형성된 열확산층; 상기 열확산층의 일면 또는 양면상에 배치되며 금속산화물 및 합금으로 이루어진 군에서 선택된 하나 이상을 포함하는 무기재료에 의하여 형성된 열전도층; 및 상기 열전도층의 일면 또는 양면 상에 배치되는 점착층을 포함하는 도전성 방열시트 도전성 방열시트, 이를 포함하는 전자부품 및 전자제품을 개시한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)