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1. (WO2014204176) PAINLESS AND PATCHLESS SHOOTING MICROSTRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/204176 International Application No.: PCT/KR2014/005310
Publication Date: 24.12.2014 International Filing Date: 17.06.2014
IPC:
A61M 37/00 (2006.01)
Applicants: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY[KR/KR]; 1FL., Yonsei Univ., Engineering Research Park, 50 Yonsei-ro Seodaemun-gu Seoul 120-752, KR
Inventors: JUNG, Hyung Il; KR
FAKHRAEI LAHIJI, Shayan; KR
Agent: YANG, Boo-Hyun; KR
Priority Data:
10-2013-006910217.06.2013KR
Title (EN) PAINLESS AND PATCHLESS SHOOTING MICROSTRUCTURE
(FR) MICROSTRUCTURE À INJECTION SANS DOULEUR ET SANS PIÈCE
(KO) 무고통 및 무패치의 슈팅 마이크로구조체
Abstract: front page image
(EN) The present invention relates to a painless and patchless shooting microstructure, and a microstructure shooting device. According to the present invention, it is possible to inject a microstructure into the skin within the time of less than one second, and the inconvenience of waiting for the decomposition of a microstructure and removing a patch are completely overcome. A patch-type conventional technology has a problem wherein it is difficult to be applied to a region having hair, but the present invention completely overcomes this problem. According to the present invention, it is possible to precisely control the permeation depth of a microstructure into the skin by controlling discharge power.
(FR) La présente invention concerne une microstructure à injection sans douleur et sans pièce, et un dispositif d'injection de microstructure. Selon la présente invention, il est possible d'injecter une microstructure dans la peau en moins d'une seconde, et les inconvénients d'attente de la décomposition d'une microstructure et de retrait d'une pièce sont totalement éliminés. Une technologie conventionnelle de type à pièce présente un problème en ce qu'il est difficile de l'appliquer à une région ayant des poils, mais la présente invention résout totalement ce problème. Selon la présente invention, il est possible de contrôler précisément la profondeur de perméation d'une microstructure dans la peau en contrôlant la puissance de décharge.
(KO) 본 발명은 무고통 및 무패치의 슈팅 마이크로구조체 및 마이크로구조체 슈팅 디바이스에 관한 것이다. 본 발명에 따르면, 1초 미만의 시간으로 마이크로구조체를 피부 내로 투입시킬 수 있고, 마이크로구조체의 분해를 기다리고 패치를 제거하는 불편함이 완벽하게 극복된다. 패치 방식의 종래기술은 체모가 있는 부위에 적용하기 어려운 문제가 있는데, 본 발명은 이러한 문제점을 완벽하게 극복한다. 본 발명에 따르면, 배출력을 조절함으로써 마이크로구조체의 피부 내 투과 깊이를 정교하게 조절할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)