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1. (WO2014204173) PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND DRY FILM SOLDER RESIST
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2014/204173    International Application No.:    PCT/KR2014/005305
Publication Date: 24.12.2014 International Filing Date: 17.06.2014
IPC:
G03F 7/004 (2006.01), G03F 7/032 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336 (KR)
Inventors: CHOI, Byung Ju; (KR).
JEONG, Woo Jae; (KR).
CHOI, Bo Yun; (KR).
LEE, Kwang Joo; (KR).
JEONG, Min Su; (KR).
KU, Se Jin; (KR)
Agent: YOU ME PATENT AND LAW FIRM; 115 Teheran-ro, Gangnam-gu, Seoul 135-912 (KR)
Priority Data:
10-2013-0068961 17.06.2013 KR
10-2014-0072906 16.06.2014 KR
Title (EN) PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND DRY FILM SOLDER RESIST
(FR) COMPOSITION DE RÉSINE PHOTODURCISSABLE ET THERMODURCISSABLE ET RÉSERVE DE SOUDURE À FILM SEC
(KO) 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
Abstract: front page image
(EN)The present invention relates to a resin composition which is photocurable and thermosetting, and which comprises an acid-modified oligomer, a photo-polymerizable monomer, a thermosetting binder resin, a photoinitiator, at least two types of spherical alumina particles having mutually different particle sizes, and an organic solvent; a dry film solder resist obtained from the resin composition; and a circuit board comprising the dry film solder resist.
(FR)La présente invention concerne une composition de résine photodurcissable et thermodurcissable qui comprend un oligomère modifié par un acide, un monomère photopolymérisable, une résine liant thermodurcissable, un photoamorceur, au moins deux types de particules d'alumine sphériques ayant des tailles de particules différentes, et un solvant organique. L'invention concerne également une réserve de soudure à film sec obtenue à partir de cette composition de résine, ainsi qu'une carte de circuit imprimé comprenant cette réserve de soudure à film sec.
(KO)본 발명은 산변성 올리고머, 광중합성 모노머, 열경화성 바인더 수지, 광개시제, 서로 다른 입경을 갖는 2종 이상의 구형 알루미나 입자, 및 유기 용매를 포함하고, 광경화성 및 열경화성을 갖는 수지 조성물과, 상기 수지 조성물로부터 얻어지는 드라이 필름 솔더 레지스트와, 상기 드라이 필름 솔더 레지스트를 포함하는 회로 기판에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)