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1. (WO2014203946) STRUCTURE FOR CONNECTING TERMINAL AND ELECTRIC WIRE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/203946 International Application No.: PCT/JP2014/066216
Publication Date: 24.12.2014 International Filing Date: 18.06.2014
IPC:
H01R 4/02 (2006.01) ,B23K 11/00 (2006.01) ,B23K 20/10 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
02
Soldered or welded connections
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
11
Resistance welding; Severing by resistance heating
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10
making use of vibrations, e.g. ultrasonic welding
Applicants: YAZAKI CORPORATION[JP/JP]; 4-28, Mita 1-chome, Minato-ku, Tokyo 1088333, JP
Inventors: MORI Shigeo; JP
Agent: HONDA Hironori; JP
Priority Data:
2013-12905919.06.2013JP
Title (EN) STRUCTURE FOR CONNECTING TERMINAL AND ELECTRIC WIRE
(FR) STRUCTURE POUR CONNECTER UNE BORNE ET UN FIL ÉLECTRIQUE
(JA) 端子と電線の接合構造
Abstract:
(EN) In this structure for connecting a terminal and an electric wire, a core wire (27) exposed from an electric wire (23) is bonded to a terminal (11). The terminal comprises a bonding surface (21) where the outer peripheral surface of the core wire (27) is bonded, a rising part (15) continuous with the bonding surface (21), and a through-hole (17) which is formed in the rising part (15) and through which the core wire (27) is inserted. The through-hole (17) is formed to the same size as the cross-section of the core wire (27).
(FR) Dans cette structure de connexion d'une borne et d'un fil électrique, un fil d'âme (27) dénudé à partir d'un fil électrique (23) est lié à une borne (11). La borne comprend une surface de liaison (21) au niveau de laquelle la surface périphérique extérieure du fil d'âme (27) est liée, une partie montante (15) continue avec la surface de liaison (21), et un trou traversant (17) qui est formé dans la partie montante (15) et à travers lequel le fil d'âme (27) est inséré. Le trou traversant (17) est formé à la même dimension que la section transversale du fil d'âme (27).
(JA)  電線(23)から露出された芯線(27)を端子(11)に接合する電線と端子の接合構造であり、端子は、芯線(27)の外周面が接合される接合面(21)と、接合面(21)と連なる立ち上げ部(15)と、立ち上げ部(15)に形成され、芯線(27)が挿通される貫通孔(17)とを有し、貫通孔(17)は、芯線(27)の断面と同等の大きさに形成される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)