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1. (WO2014200110) REACTIVE SILICONE COMPOSITION, REACTIVE THERMOPLASTIC, CURED PRODUCT AND PHOTOSEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/200110 International Application No.: PCT/JP2014/065831
Publication Date: 18.12.2014 International Filing Date: 10.06.2014
IPC:
C08L 83/07 (2006.01) ,C08K 3/36 (2006.01) ,C08K 5/09 (2006.01) ,C08K 7/14 (2006.01) ,C08L 83/05 (2006.01) ,H01L 33/60 (2010.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
09
Carboxylic acids; Metal salts thereof; Anhydrides thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
14
Glass
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
60
Reflective elements
Applicants: DOW CORNING TORAY CO., LTD.[JP/JP]; 1-5-1, Otemachi, Chiyoda-ku, Tokyo 1000004, JP
Inventors: YAMAZAKI, Ryosuke; JP
YOSHITAKE, Makoto; JP
Priority Data:
2013-12522114.06.2013JP
Title (EN) REACTIVE SILICONE COMPOSITION, REACTIVE THERMOPLASTIC, CURED PRODUCT AND PHOTOSEMICONDUCTOR DEVICE
(FR) COMPOSITION DE SILICIUM RÉACTIVE, THERMOPLASTIQUE RÉACTIF, PRODUIT DURCI ET DISPOSITIF SEMI-CONDUCTEUR PHOTOÉLECTRIQUE
(JA) 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
Abstract:
(EN) Provided are: a reactive silicon composition which comprises at least (A) an organo polysiloxane having an alkenyl group, (B) an organo polysiloxane having an alkenyl group, (C) an organo polysiloxane having a silicon-bonded hydrogen atom, (D) a hydrosilylation reaction catalyst, (E) a white pigment, (F) spherical silica, nonspherical silica, or glass fiber, and (G) a carboxylic acid or metal salt thereof having ten or more carbon atoms and at least one carbon-carbon double bond per molecule; a reactive thermoplastic thereof, a cured product thereof and a photosemiconductor device having the cured product. The present invention provides: a reactive silicon composition which is capable of forming a reactive thermoplastic; a reactive thermoplastic which temporarily fluidizes when heated, then provides a cured product; a cured product which has small reduction in mechanical strength and less discoloration due to heat and light, a high optical reflectivity, and excellent mold releasability; and a photosemiconductor device which has a high luminous efficiency, less thermal degradation and photodegradation of a light reflection material, and excellent reliability.
(FR) La présente invention concerne : une composition de silicium réactive comprenant au moins (A) un organo polysiloxane comprenant un groupe alcényle, (B) un organo polysiloxane comprenant un groupe alcényle, (C) un organo polysiloxane comprenant un atome d'hydrogène lié à un silicium, (D) un catalyseur de réaction d'hydrosilylation, (E) un pigment blanc, (F) de la silice sphérique, de la silice non sphérique, ou de la fibre de verre, et (G) un acide carboxylique ou un sel métallique associé comprenant dix atomes de carbone ou plus et au moins une double-liaison carbone-carbone par molécule ; un thermoplastique réactif associé, un produit durci associé et un dispositif semi-conducteur photoélectrique comprenant le produit durci. La présente invention concerne : une composition de silicium réactive pouvant former un thermoplastique réactif ; un thermoplastique réactif qui se fluidise temporairement une fois chauffé, puis fournit un produit durci ; un produit durci qui présente une faible diminution de la résistance mécanique et une moindre décoloration due à la chaleur et à la lumière, une réflectivité optique élevée, et une excellente capacité d’anti-adhérence au moule ; et un dispositif semi-conducteur photoélectrique qui présente une efficacité lumineuse élevée, une moindre dégradation thermique et une moindre photodégradation d'un matériau réfléchissant la lumière, et une excellente fiabilité.
(JA) (A)アルケニル基を有するオルガノポリシロキサン、(B)アルケニル基を有するオルガノポリシロキサン、(C)ケイ素原子結合水素原子を有するオルガノポリシロキサン、(D)ヒドロシリル化反応用触媒、(E)白色顔料、(F)球状シリカ、非球状シリカまたはガラスファイバー、(G)一分子中に少なくとも1個の炭素-炭素二重結合を有し、炭素原子数が10以上のカルボン酸またはその金属塩から少なくともなる反応性シリコーン組成物、その反応性熱可塑体、それらの硬化物、およびその硬化物を有する光半導体装置。反応性熱可塑体を形成し得る反応性シリコーン組成物、加熱すると一旦流動化し、その後、硬化物を与える反応性熱可塑体、熱や光による機械的強度の低下や変色が少なく、光反射率が高く、金型離型性が優れる硬化物、および発光効率が高く、光反射材の熱劣化や光劣化が少なく、信頼性が優れる光半導体装置を提供。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)