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1. (WO2014200100) ADHESIVE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2014/200100 International Application No.: PCT/JP2014/065801
Publication Date: 18.12.2014 International Filing Date: 13.06.2014
IPC:
C09J 183/04 (2006.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01) ,C09J 163/00 (2006.01) ,C09J 163/02 (2006.01) ,C09J 171/02 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
02
Polyglycidyl ethers of bis-phenols
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
171
Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
02
Polyalkylene oxides
Applicants:
積水フーラー株式会社 SEKISUI FULLER COMPANY, LTD. [JP/JP]; 東京都港区港南二丁目13番34号 NSS-IIビル NSS-II Bldg., 13-34, Konan 2-chome, Minato-ku, Tokyo 1080075, JP
Inventors:
楠田 智 KUSUDA, Satoshi; JP
村山 之彦 MURAYAMA, Yukihiko; JP
Agent:
山本 拓也 YAMAMOTO, Takuya; JP
Priority Data:
2013-12547714.06.2013JP
2013-26380020.12.2013JP
Title (EN) ADHESIVE COMPOSITION
(FR) COMPOSITION D'ADHÉSIF
(JA) 接着剤組成物
Abstract:
(EN)  The present invention provides an adhesive composition having excellent adhesive strength. This adhesive composition is characterized by containing 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1-20 parts by weight of epoxy resin, 0.1-10 parts by weight of an epoxy silane coupling agent, 0.5-20 parts by weight of a ketimine compound, and 1-100 parts by weight of fatty-acid-treated calcium oxide.
(FR)  Cette invention concerne une composition d'adhésif ayant une excellente force adhésive, ladite composition d'adhésif étant caractérisée en ce qu'elle contient 100 parties en poids d'un oxyde de polyalkylène ayant un groupe silyle hydrolysable, de 1 à 20 parties en poids de résine époxy, de 0,1 à 10 parties en poids d'un agent de couplage époxysilane, de 0,5 à 20 parties en poids d'un composé de cétimine, et de 1 à 100 parties en poids d'un oxyde de calcium traité par un acide gras.
(JA)  本発明は、接着強度に優れた接着剤組成物を提供する。本発明の接着剤組成物は、加水分解性シリル基を有するポリアルキレンオキサイド100重量部、エポキシ樹脂1~20重量部、エポキシシランカップリング剤0.1~10重量部、ケチミン化合物0.5~20重量部、及び脂肪酸処理酸化カルシウム1~100重量部を含有することを特徴とする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)