Search International and National Patent Collections
|1. (WO2014199992) ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING ADHESIVE SHEET|
|Applicants:||DENKA COMPANY LIMITED
|Title:||ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING ADHESIVE SHEET|
Provided is an adhesive sheet such that there is no decrease over time in pickup properties of a chip during a pickup step, and that can be used in production lines both having and not having heating before dicing. The adhesive sheet has an adhesive layer comprising an adhesive composition on a substrate film containing polyvinyl chloride and a polyester plasticizer, wherein the adhesive composition contains 100 parts by mass of a (meth)acrylic ester copolymer and 0.01-5 parts by mass of an isocyanate curing agent, and the (meth)acrylic ester compolymer has a weight average molecular weight of 400,000-1,000,000 and contains 40-90 mass% of a butyl(meth)acrylate unit, 5-55 mass% of a methyl(meth)acrylate unit, and 0.1-10 mass% of a monomer unit having a hydroxyl group.