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1. (WO2014199992) ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING ADHESIVE SHEET

Pub. No.:    WO/2014/199992    International Application No.:    PCT/JP2014/065369
Publication Date: Fri Dec 19 00:59:59 CET 2014 International Filing Date: Wed Jun 11 01:59:59 CEST 2014
IPC: C09J 7/02
C09J 11/06
C09J 133/06
C09J 133/14
H01L 21/301
Applicants: DENKA COMPANY LIMITED
デンカ株式会社
Inventors: TSUKUI Tomoya
津久井 友也
KUME Masashi
久米 雅士
SAITO Takeshi
齊藤 岳史
Title: ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING ADHESIVE SHEET
Abstract:
Provided is an adhesive sheet such that there is no decrease over time in pickup properties of a chip during a pickup step, and that can be used in production lines both having and not having heating before dicing. The adhesive sheet has an adhesive layer comprising an adhesive composition on a substrate film containing polyvinyl chloride and a polyester plasticizer, wherein the adhesive composition contains 100 parts by mass of a (meth)acrylic ester copolymer and 0.01-5 parts by mass of an isocyanate curing agent, and the (meth)acrylic ester compolymer has a weight average molecular weight of 400,000-1,000,000 and contains 40-90 mass% of a butyl(meth)acrylate unit, 5-55 mass% of a methyl(meth)acrylate unit, and 0.1-10 mass% of a monomer unit having a hydroxyl group.